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SN74LVC3G06 PDF预览

SN74LVC3G06

更新时间： 2024-11-15 22:28:11
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
12页 318K
描述
TRIPLE INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS

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中文翻译

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SN74LVC3G06 数据手册

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SCES364G− AUGUST 2001 − REVISED AUGUST 2003  
DCT OR DCU PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
Supports 5-V V  
Operation  
CC  
1A  
3Y  
2A  
V
CC  
1
2
3
4
8
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5
D
Input and Open-Drain Output Accepts  
Voltages Up To 5.5 V  
1Y  
3A  
2Y  
GND  
D
D
D
D
D
D
D
D
Max t of 3.4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
= 3.3 V, T = 25°C  
OLP  
CC  
A
4 5  
3 6  
2 7  
1 8  
GND  
2A  
3Y  
2Y  
3A  
1Y  
V
Typical V  
(Output V  
= 3.3 V, T = 25°C  
Undershoot)  
OHV  
OH  
>2 V at V  
CC  
A
1A  
I
Supports Partial-Power-Down Mode  
CC  
off  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This triple inverter buffer/driver is designed for 1.65-V to 5.5-V V  
operation.  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC3G06YEAR  
SN74LVC3G06YZAR  
SN74LVC3G06YEPR  
SN74LVC3G06YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CT_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SSOP − DCT  
Reel of 3000  
Reel of 3000  
SN74LVC3G06DCTR  
SN74LVC3G06DCUR  
C06_ _ _  
C06_  
VSSOP − DCU  
Reel of 250  
SN74LVC3G06DCUT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2003, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...12

中文翻译

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SN74LVC3G06 替代型号

型号 品牌 替代类型 描述 数据表
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