SN74LVC2G32-EP
DUAL 2-INPUT POSITIVE-OR GATE
www.ti.com
SCES543A–FEBRUARY 2004–REVISED AUGUST 2006
FEATURES
•
Controlled Baseline
•
•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
– One Assembly/Test Site, One Fabrication
Site
Ioff Supports Partial Power-Down-Mode
Operation
•
•
Extended Temperature Performance of –55°C
to 125°C
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Enhanced Diminishing Manufacturing
Sources (DMS) Support
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
•
•
•
•
•
•
•
•
Enhanced Product-Change Notification
(1)
Qualification Pedigree
Supports 5-V VCC Operation
– 1000-V Charged-Device Model (C101)
Inputs Accept Voltages to 5.5 V
Max tpd of 3.8 ns at 3.3 V
DCU PACKAGE
(TOP VIEW)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
1A
1B
2Y
V
CC
1
2
3
4
8
7
6
5
1Y
2B
2A
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
GND
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
This dual 2-input positive-OR gate is designed for 1.65-V to 5.5-V VCC operation.
Y + A ) B or Y + A • B
The SN74LVC2G32 performs the Boolean function
in positive logic.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
–55°C to 125°C
SSOP – DCU
Reel of 3000
SN74LVC2G32MDCUREP
BUE
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DCU: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
FUNCTION TABLE
(EACH GATE)
INPUTS
OUTPUT
Y
A
H
X
L
B
X
H
L
H
H
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.