SN74LVC2G240DCT

更新时间： 2024-11-04 13:01:59

品牌	Logo	应用领域
德州仪器 - TI		驱动器输出元件
页数	文件大小	规格书
11页	308K
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SN74LVC2G240DCT 数据手册

SN74LVC2G240

DUAL BUFFER/DRIVER

WITH 3-STATE OUTPUTS

www.ti.com

SCES208H–APRIL 1999–REVISED FEBRUARY 2007

FEATURES

•

Available in the Texas Instruments

NanoFree™ Package

•

Typical V_OHV(Output V_OHUndershoot) >2 V at

V_CC= 3.3 V, T_A= 25°C

•

Supports 5-V V_CCOperation

I_offSupports Partial-Power-Down Mode

Operation

Inputs Accept Voltages to 5.5 V

Max t_pdof 4.6 ns at 3.3 V

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

Low Power Consumption, 10-µA Max I_CC

±24-mA Output Drive at 3.3 V

ESD Protection Exceeds JESD 22

–

2000-V Human-Body Model (A114-A)

1000-V Charged-Device Model (C101)

Typical V_OLP(Output Ground Bounce) <0.8 V

at V_CC= 3.3 V, T_A= 25°C

DCT PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

DCU PACKAGE

(TOP VIEW)

4 5

GND

V_CC

2OE

1OE

V_CC

2OE

1OE

3 6

2 7

1 8

2OE

V_CC

1OE

GND

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

This dual buffer/driver is designed for 1.65-V to 5.5-V V_CCoperation.

The SN74LVC2G240 is designed specifically to improve the performance and density of 3-state memory

address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING⁽²⁾

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

(Pb-free)

Reel of 3000

SN74LVC2G240YZPR

_ _ _CK_

–40°C to 85°C

SSOP – DCT

Reel of 3000

SN74LVC2G240DCTR

SN74LVC2G240DCUR

C40_ _ _

C40_

VSSOP – DCU

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...11

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与SN74LVC2G240DCT相关器件

型号	品牌	获取价格	描述	数据表
SN74LVC2G240DCTR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G240DCU	TI	获取价格	暂无描述
SN74LVC2G240DCUR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G240YEAR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G240YEPR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G240YZAR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G240YZPR	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G241	TI	获取价格	DUAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
SN74LVC2G241_15	TI	获取价格	Dual Buffer and Driver With 3-State Outputs
SN74LVC2G241DCTR	ROCHESTER	获取价格	LVC/LCX/Z SERIES, DUAL 1-BIT DRIVER, TRUE OUTPUT, PDSO8, GREEN, PLASTIC, SSOP-8

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