SN74LVC2G08-EP
DUAL 2-INPUT POSITIVE-AND GATE
www.ti.com
SGDS032–SEPTEMBER 2007
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FEATURES
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Controlled Baseline
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Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
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One Assembly
Ioff Supports Partial-Power-Down Mode
Operation
One Test Site
One Fabrication Site
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
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Enhanced Diminishing Manufacturing Sources
(DMS) Support
ESD Protection Exceeds JESD 22
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Enhanced Product-Change Notification
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2000-V Human-Body Model (A114-A)
1000-V Charged-Device Model (C101)
(1)
Qualification Pedigree
Supports 5-V VCC Operation
DCU PACKAGE
(TOP VIEW)
Inputs Accept Voltages to 5.5 V
Max tpd of 5.7 ns at 3.3 V
VCC
1Y
2B
2A
1
2
3
4
8
7
6
5
1A
1B
Low Power Consumption, 10 μA Max ICC
±24 mA Output Drive at 3.3 V
2Y
Typical VOLP (Output Ground Bounce) <0.8 V at
VCC = 3.3 V, TA = 25°C
GND
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
See mechanical drawings for dimensions.
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
This dual 2-input positive-AND gate is designed for 1.65-V to 5.5-V VCC operation.
Y + A • B or Y + A ) B
The SN74LVC2G08 performs the Boolean function
in positive logic.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–55°C to 125°C
VSSOP – DCU
Reel of 3000
SN74LVC2G08MDCUREP
SBNM
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.