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SN74LVC2G07 PDF预览

SN74LVC2G07

更新时间: 2024-09-29 23:06:23
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 363K
描述
DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS

SN74LVC2G07 数据手册

 浏览型号SN74LVC2G07的Datasheet PDF文件第2页浏览型号SN74LVC2G07的Datasheet PDF文件第3页浏览型号SN74LVC2G07的Datasheet PDF文件第4页浏览型号SN74LVC2G07的Datasheet PDF文件第5页浏览型号SN74LVC2G07的Datasheet PDF文件第6页浏览型号SN74LVC2G07的Datasheet PDF文件第7页 
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢂ  
ꢊꢋꢌ ꢄ ꢍꢋꢎ ꢎ ꢏ ꢐꢑ ꢊꢐ ꢒ ꢅꢏ ꢐ  
ꢓ ꢒꢔ ꢕ ꢖ ꢗꢏꢁ ꢘꢊꢐꢌꢒ ꢁ ꢖ ꢋꢔ ꢗ ꢋꢔꢀ  
SCES308E − AUGUST 2001 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
D
Inputs and Open-Drain Outputs Accept  
Voltages Up To 5.5 V  
V
CC  
2Y  
D
D
D
D
D
D
D
D
Max t of 3.7 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
24-mA Output Drive at 3.3 V  
Typical V (Output Ground Bounce)  
OLP  
CC  
3 4  
2 5  
1 6  
2A  
GND  
1A  
2Y  
<0.8 V at V  
= 3.3 V, T = 25°C  
A
V
CC  
Typical V  
(Output V  
Undershoot)  
1Y  
OHV  
OH  
>2 V at V  
= 3.3 V, T = 25°C  
CC  
A
I
Supports Partial-Power-Down Mode  
off  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This dual buffer/driver is designed for 1.65-V to 5.5-V V  
operation. The output of the SN74LVC2G07 is open  
CC  
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high  
wired-AND functions. The maximum sink current is 32 mA.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC2G07YEAR  
SN74LVC2G07YZAR  
SN74LVC2G07YEPR  
SN74LVC2G07YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CV_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SOT (SOT-23) − DBV  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G07DBVR  
SN74LVC2G07DCKR  
SN74LVC2G07DCKT  
C07_  
CV_  
SOT (SC-70) − DCK  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA,YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢔꢤ  
Copyright 2003, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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