是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | VFBGA, BGA6,2X3,20 | 针数: | 6 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.47 | 系列: | LVC/LCX/Z |
JESD-30 代码: | R-XBGA-B6 | JESD-609代码: | e1 |
长度: | 1.4 mm | 负载电容(CL): | 50 pF |
逻辑集成电路类型: | INVERTER | 最大I(ol): | 0.032 A |
湿度敏感等级: | 1 | 功能数量: | 2 |
输入次数: | 1 | 端子数量: | 6 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
输出特性: | OPEN-DRAIN | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装等效代码: | BGA6,2X3,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法: | TR | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3 V | 最大电源电流(ICC): | 0.01 mA |
Prop。Delay @ Nom-Sup: | 3.4 ns | 传播延迟(tpd): | 7.2 ns |
认证状态: | Not Qualified | 施密特触发器: | NO |
座面最大高度: | 0.5 mm | 子类别: | Gates |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.65 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) | 端子形式: | BALL |
端子节距: | 0.5 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 0.9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
SN74LVC2G06YEPR | TI |
类似代替 |
DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS | |
SN74LVC2G06YZAR | TI |
功能相似 |
DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS | |
SN74LVC2G06YEAR | TI |
功能相似 |
DUAL INVERTER BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS |
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