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SN74LVC1G86 PDF预览

SN74LVC1G86

更新时间： 2024-11-03 23:11:03
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
15页 350K
描述
SINGLE 2-INPUT EXCLUSIVE-OR GATE

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SN74LVC1G86 数据手册

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SN74LVC1G86  
SINGLE 2-INPUT EXCLUSIVE-OR GATE  
SCES222K – APRIL 1999 – REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
Supports 5-V V  
Operation  
CC  
1
2
3
5
4
A
B
GND  
V
Y
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
24-mA Output Drive at 3.3 V  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2
GND  
B
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
1 5  
A
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single 2-input exclusive-OR gate is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G86 performs the Boolean function Y = A ⊕ B or Y = AB + AB in positive logic.  
A common application is as a true/complement element. If the input is low, the other input is reproduced in true  
form at the output. If the input is high, the signal on the other input is reproduced inverted at the output.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar– WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC1G86YEAR  
SN74LVC1G86YZAR  
SN74LVC1G86YEPR  
SN74LVC1G86YZPR  
NanoFree– WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
Reel of 3000  
_ _ _CH_  
NanoStar– WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree– WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G86DBVR  
SN74LVC1G86DBVT  
SN74LVC1G86DCKR  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
C86_  
CH_  
Reel of 250  
SN74LVC1G86DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...15

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SN74LVC1G86 替代型号

型号 品牌 替代类型 描述 数据表
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