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SN74LVC1G80_07

更新时间： 2024-11-04 05:29:35
品牌 Logo 应用领域
德州仪器 - TI 触发器
页数 文件大小 规格书
16页 514K
描述
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

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SN74LVC1G80_07 数据手册

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SN74LVC1G80  
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP  
www.ti.com  
SCES221Q–APRIL 1999–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
•
•
•
•
•
Supports 5-V VCC Operation  
ESD Protection Exceeds JESD 22  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4.2 ns at 3.3 V  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Ioff Supports Partial-Power-Down Mode  
Operation  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
GND  
CLK  
D
Q
VCC  
1
2
3
5
D
CLK  
GND  
VCC  
1
2
3
5
4
D
CLK  
5
VCC  
4
Q
GND  
Q
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCC operation.  
When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the  
positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the  
rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without  
affecting the level at the output.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000  
SN74LVC1G80YZPR  
_ _ _CX_  
C80_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G80DBVR  
SN74LVC1G80DBVT  
SN74LVC1G80DCKR  
SN74LVC1G80DCKT  
–40°C to 85°C  
SOT (SC-70) – DCK  
CX_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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