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SN74LVC1G57YZAR

更新时间： 2024-09-26 22:08:39
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
14页 303K
描述
CONFIGURABLE MULTIPLE FUNCTION GATE

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SN74LVC1G57YZAR 数据手册

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SCES414G − NOVEMBER 2002 − REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
In1  
GND  
In0  
In2  
Inputs Accept Voltages to 5.5 V  
V
Y
CC  
Max t of 6.3 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
CC  
YEA, YEP, YZA OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2 5  
1 6  
In0  
GND  
In1  
Y
V
Latch-Up Performance Exceeds 100 mA  
Per JESD 78, Class II  
CC  
In2  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This configurable multiple-function gate is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G57 features configurable multiple functions. The output state is determined by eight patterns  
of 3-bit input. The user can choose the logic functions AND, OR, NAND, NOR, XNOR, inverter, and noninverter.  
All inputs can be connected to V  
or GND.  
CC  
This device functions as an independent gate, but because of Schmitt action, it may have different input  
threshold levels for positive-going (V ) and negative-going (V ) signals.  
T+  
T−  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G57YEAR  
SN74LVC1G57YZAR  
SN74LVC1G57YEPR  
SN74LVC1G57YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Tape and reel  
_ _ _CL_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
Tape and reel  
Tape and reel  
SN74LVC1G57DBVR  
SN74LVC1G57DCKR  
CA7_  
CL_  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA,YEP/YZP:The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2003, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...14

中文翻译

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SN74LVC1G57YZAR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G57YEAR TI

完全替代

 CONFIGURABLE MULTIPLE FUNCTION GATE
SN74LVC1G57YEPR TI

完全替代

 CONFIGURABLE MULTIPLE FUNCTION GATE
SN74LVC1G57YZPR TI

类似代替

 CONFIGURABLE MULTIPLE FUNCTION GATE

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