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SN74LVC1G34YZPR PDF预览

SN74LVC1G34YZPR

更新时间: 2024-11-01 22:17:03
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
14页 369K
描述
SINGLE BUFFER GATE

SN74LVC1G34YZPR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:BGA
包装说明:VFBGA, BGA5,2X3,20针数:5
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.41系列:LVC/LCX/Z
JESD-30 代码:R-XBGA-B5JESD-609代码:e1
长度:1.4 mm负载电容(CL):50 pF
逻辑集成电路类型:BUFFER最大I(ol):0.032 A
湿度敏感等级:1功能数量:1
输入次数:1端子数量:5
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:VFBGA封装等效代码:BGA5,2X3,20
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
包装方法:TR峰值回流温度(摄氏度):260
电源:3.3 V最大电源电流(ICC):0.01 mA
Prop。Delay @ Nom-Sup:4.1 ns传播延迟(tpd):9.9 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:0.5 mm子类别:Gates
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:0.5 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:0.9 mm
Base Number Matches:1

SN74LVC1G34YZPR 数据手册

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SN74LVC1G34  
SINGLE BUFFER GATE  
www.ti.com  
SCES519FDECEMBER 2003REVISED OCTOBER 2005  
FEATURES  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 3.5 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Low Power Consumption, 1-µA Max ICC  
±24-mA Output Drive at 3.3 V  
– 1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
NC  
A
V
Y
1
2
3
5
1
2
3
5
NC  
A
V
CC  
CC  
1
2
3
5
NC  
A
V
Y
CC  
4
GND  
Y
4
GND  
4
GND  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
YZV PACKAGE  
(BOTTOM VIEW)  
3
4
2
3
Y
Y
V
GND  
A
GND  
A
2
1
1
4
CC  
5
DNU  
V
CC  
DNU − Do not use  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single buffer gate is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G34 performs the Boolean  
function Y = A in positive logic.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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