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SN74LVC1G332YZPR PDF预览

SN74LVC1G332YZPR

更新时间： 2024-11-26 23:11:03
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德州仪器 - TI 输入元件
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11页 253K
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SINGLE 3 INPUT POSITIVE OR GATE

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SN74LVC1G332YZPR 数据手册

 浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第2页浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第3页浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第4页浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第5页浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第6页浏览型号SN74LVC1G332YZPR的Datasheet PDF文件第7页 
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢉ ꢊ  
ꢀꢋ ꢁꢈ ꢄ ꢌ ꢉ ꢍꢋꢁ ꢎꢏꢐ ꢎꢑ ꢀꢋ ꢐ ꢋꢅꢌꢍ ꢑ ꢒ ꢈ ꢓꢐꢌ  
SCES489C − SEPTEMBER 2003 − REVISED MARCH 2004  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
6
5
4
A
GND  
B
C
Inputs Accept Voltages to 5.5 V  
V
Y
CC  
Max t of 4.5 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2 5  
1 6  
B
GND  
A
Y
V
C
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
Y + A ) B ) C or Y + A • B • C  
The SN74LVC1G332 performs the Boolean function  
in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
SN74LVC1G332YEPR  
Reel of 3000  
_ _ _CZ_  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
SN74LVC1G332YZPR  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G332DBVR  
SN74LVC1G332DBVT  
SN74LVC1G332DCKR  
SOT (SOT-23) − DBV  
C2C_  
CZ_  
SOT (SC-70) − DCK  
Reel of 250  
SN74LVC1G332DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin  
1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢎꢒ ꢑ ꢔꢏ ꢆ ꢐꢋ ꢑ ꢁ ꢔ ꢓꢐꢓ ꢕꢖ ꢗ ꢘꢙ ꢚ ꢛꢜ ꢕꢘꢖ ꢕꢝ ꢞꢟ ꢙ ꢙ ꢠꢖꢜ ꢛꢝ ꢘꢗ ꢡꢟꢢ ꢣꢕꢞ ꢛꢜ ꢕꢘꢖ ꢤꢛ ꢜꢠ ꢥ  
ꢎꢙ ꢘ ꢤꢟꢞ ꢜ ꢝ ꢞ ꢘꢖ ꢗꢘ ꢙ ꢚ ꢜ ꢘ ꢝ ꢡꢠ ꢞ ꢕꢗ ꢕꢞꢛ ꢜꢕ ꢘꢖꢝ ꢡꢠ ꢙ ꢜꢦ ꢠ ꢜꢠ ꢙ ꢚꢝ ꢘꢗ ꢐꢠꢧ ꢛꢝ ꢋꢖꢝ ꢜꢙ ꢟꢚ ꢠꢖꢜ ꢝ  
ꢝ ꢜ ꢛ ꢖꢤ ꢛ ꢙꢤ ꢨ ꢛ ꢙꢙ ꢛ ꢖ ꢜꢩꢥ ꢎꢙ ꢘ ꢤꢟꢞ ꢜꢕꢘꢖ ꢡꢙ ꢘꢞ ꢠꢝ ꢝꢕ ꢖꢪ ꢤꢘꢠ ꢝ ꢖꢘꢜ ꢖꢠ ꢞꢠ ꢝꢝ ꢛꢙ ꢕꢣ ꢩ ꢕꢖꢞ ꢣꢟꢤ ꢠ  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
Copyright 2004, Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...11

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SN74LVC1G332YZPR 替代型号

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SN74LVC1G332YEPR TI

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