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SN74LVC1G3208DCK

更新时间： 2024-11-08 22:35:11
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德州仪器 - TI 输入元件
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13页 282K
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SINGLE 3-INPUT POSITIVE OR-AND GATE

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SN74LVC1G3208DCK 数据手册

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SN74LVC1G3208  
SINGLE 3-INPUT POSITIVE OR-AND GATE  
www.ti.com  
SCES605A–SEPTEMBER 2004–REVISED JUNE 2005  
FEATURES  
•
Can Be Used in Three Combinations:  
– OR-AND Gate  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
– OR Gate  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5 ns at 3.3 V  
– AND Gate  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
Input Hysteresis Allows Slow Input Transition  
and Better Switching Noise Immunity at the  
Input  
(Vhys = 250 mV Typ @ 3.3 V)  
– 1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
DCK PACKAGE  
(TOP VIEW)  
3
4
Y
V
A
C
1
2
3
6
5
4
B
GND  
A
1
2
3
6
A
GND  
B
C
V
2
1
5
6
CC  
GND  
B
V
Y
CC  
C
5
4
CC  
Y
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This device is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC1G3208 is a single 3-input positive OR-AND gate. It performs the Boolean function Y = (A + B)  
in positive logic.  
C
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC1G3208YEPR  
Reel of 3000  
_ _ _ DD _  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
SN74LVC1G3208YZPR  
–40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G3208DBVR  
SN74LVC1G3208DBVT  
SN74LVC1G3208DCKR  
SN74LVC1G3208DCKT  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
CDD_  
DD_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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