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SN74LVC1G240 PDF预览

SN74LVC1G240

更新时间: 2024-11-17 23:11:03
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 330K
描述
SINGLE BUFFER/DRIVER WITH 3-STATE OUTPUT

SN74LVC1G240 数据手册

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ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢈ ꢉꢃ ꢊ  
ꢀꢋ ꢁꢈ ꢄ ꢌ ꢍꢎꢏ ꢏ ꢌꢐ ꢑꢒ ꢐ ꢋꢅ ꢌ ꢐ  
ꢓ ꢋꢔ ꢕ ꢖ ꢗꢀꢔꢘꢔ ꢌ ꢙ ꢎꢔ ꢚ ꢎꢔ  
SCES305H − JANUARY 2001 − REVISED OCTOBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
D
D
D
D
D
Supports 5-V V  
Operation  
CC  
1
2
3
5
4
OE  
A
GND  
V
Y
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 3.7 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
CC  
24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2
GND  
A
OE  
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
1 5  
CC  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
− 1000-V Charged-Device Model (C101)  
description/ordering information  
This single buffer/driver is designed for 1.65-V to 5.5-V V  
operation.  
CC  
The SN74LVC1G240 is a single line driver with a 3-state output. The output is disabled when the output-enable  
(OE) input is high.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G240YEAR  
SN74LVC1G240YZAR  
SN74LVC1G240YEPR  
SN74LVC1G240YZPR  
NanoFree− WCSP (DSBGA)  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CK_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
−40°C to 85°C  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G240DBVR  
SN74LVC1G240DBVT  
SN74LVC1G240DCKR  
SOT (SOT-23) − DBV  
SOT (SC-70) − DCK  
C40_  
CK_  
Reel of 250  
SN74LVC1G240DCKT  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
ꢚꢐ ꢙ ꢒꢎ ꢆ ꢔꢋ ꢙ ꢁ ꢒ ꢘꢔꢘ ꢛꢜ ꢝ ꢞꢟ ꢠ ꢡꢢ ꢛꢞꢜ ꢛꢣ ꢤꢥ ꢟ ꢟ ꢦꢜꢢ ꢡꢣ ꢞꢝ ꢧꢥꢨ ꢩꢛꢤ ꢡꢢ ꢛꢞꢜ ꢪꢡ ꢢꢦ ꢫ  
ꢚꢟ ꢞ ꢪꢥꢤ ꢢ ꢣ ꢤ ꢞꢜ ꢝꢞ ꢟ ꢠ ꢢ ꢞ ꢣ ꢧꢦ ꢤ ꢛꢝ ꢛꢤꢡ ꢢꢛ ꢞꢜꢣ ꢧꢦ ꢟ ꢢꢬ ꢦ ꢢꢦ ꢟ ꢠꢣ ꢞꢝ ꢔꢦꢭ ꢡꢣ ꢋꢜꢣ ꢢꢟ ꢥꢠ ꢦꢜꢢ ꢣ  
ꢣ ꢢ ꢡ ꢜꢪ ꢡ ꢟꢪ ꢮ ꢡ ꢟꢟ ꢡ ꢜ ꢢꢯꢫ ꢚꢟ ꢞ ꢪꢥꢤ ꢢꢛꢞꢜ ꢧꢟ ꢞꢤ ꢦꢣ ꢣꢛ ꢜꢰ ꢪꢞꢦ ꢣ ꢜꢞꢢ ꢜꢦ ꢤꢦ ꢣꢣ ꢡꢟ ꢛꢩ ꢯ ꢛꢜꢤ ꢩꢥꢪ ꢦ  
ꢢ ꢦ ꢣ ꢢꢛ ꢜꢰ ꢞꢝ ꢡ ꢩꢩ ꢧꢡ ꢟ ꢡ ꢠ ꢦ ꢢ ꢦ ꢟ ꢣ ꢫ  
Copyright 2003, Texas Instruments Incorporated  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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