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ꢋ ꢌꢍꢎ ꢌꢃ ꢄ ꢏꢁꢐ ꢑꢐ ꢆꢎ ꢑ ꢐꢒ
SCES602 − AUGUST 2004
DCT OR DCU PACKAGE
(TOP VIEW)
D
Available in the Texas Instruments
NanoStar and NanoFree Packages
D
D
D
D
D
D
D
D
Supports 5-V V
Operation
CC
V
1
2
3
4
8
7
6
5
A
B
CC
Inputs Accept Voltages to 5.5 V
Y0
Y1
Y2
Y3
GND
Max t of 4.9 ns at 3.3 V
pd
Low Power Consumption, 10-µA Max I
24-mA Output Drive at 3.3 V
CC
YEP OR YZP PACKAGE
(BOTTOM VIEW)
I
Supports Partial-Power-Down Mode
off
Operation
4 5
3 6
2 7
1 8
GND
Y3
B
Y2
Y1
Y0
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
A
V
CC
description/ordering information
This 2-to-4 line decoder is designed for 1.65-V to 5.5-V V
operation.
CC
The SN74LVC1G139 2-line to 4-line decoder is designed to be used in high-performance memory-decoding
or data-routing applications requiring very short propagation delay times. In high-performance memory
systems, this decoder can be used to minimize the effects of system decoding. When used with high-speed
memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory
usually are less than the typical access time of the memory. This means that the effective system delay
introduced by the decoder is negligible.
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
‡
NanoStar − WCSP (DSBGA)
0.23-mm Large Bump − YEP
SN74LVC1G139YEPR
SN74LVC1G139YZPR
Reel of 3000
_ _ _C9_
NanoFree − WCSP (DSBGA)
0.23-mm Large Bump − YZP (Pb-free)
−40°C to 85°C
Reel of 3000
Reel of 250
Reel of 3000
SN74LVC1G139DCTR
SN74LVC1G139DCTT
SN74LVC1G139DCUR
SSOP − DCT
C39_ _ _
C39_
VSSOP − DCU
Reel of 250
SN74LVC1G139DCUT
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin
1 identifier indicates solder-bump composition
(1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar and NanoFree are trademarks of Texas Instruments.
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Copyright 2004 Texas Instruments Incorporated
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