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SN74LVC1G08DSF2

更新时间： 2024-11-03 11:06:23
品牌 Logo 应用领域
德州仪器 - TI 栅栅极
页数 文件大小 规格书
16页 434K
描述
单路 2 输入、1.65V 至 5.5V 与门 | DSF | 6 | -40 to 125

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SN74LVC1G08DSF2 数据手册

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SCES217S − APRIL 1999 − REVISED JUNE 2005  
D
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
D
D
D
I
Supports Partial-Power-Down Mode  
off  
Operation  
D
D
D
D
D
Supports 5-V V  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
Inputs Accept Voltages to 5.5 V  
Max t of 3.6 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
CC  
− 1000-V Charged-Device Model (C101)  
YEA, YEP, YZA,  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
OR YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
Y
GND  
B
1
2
3
5
A
V
Y
A
B
V
1
2
3
5
CC  
CC  
1
2
3
5
A
B
V
Y
CC  
B
V
A
CC  
4
GND  
Y
4
GND  
4
GND  
See mechanical drawings for dimensions.  
description/ordering information  
Y + A • B or Y + A ) B  
The SN74LVC1G08 performs the Boolean function  
in positive logic.  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using I . The I circuitry disables the outputs,  
off  
off  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
PACKAGE  
T
A
‡
NanoStar− WCSP (DSBGA)  
0.17-mm Small Bump − YEA  
SN74LVC1G08YEAR  
NanoFree− WCSP (DSBGA)  
SN74LVC1G08YZAR  
SN74LVC1G08YEPR  
SN74LVC1G08YZPR  
0.17-mm Small Bump − YZA (Pb-free)  
Reel of 3000  
_ _ _CE_  
NanoStar− WCSP (DSBGA)  
0.23-mm Large Bump − YEP  
NanoFree− WCSP (DSBGA)  
0.23-mm Large Bump − YZP (Pb-free)  
−40°C to 85°C  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC1G08DBVR  
SN74LVC1G08DBVT  
SN74LVC1G08DCKR  
SN74LVC1G08DCKT  
SOT (SOT-23) − DBV  
C08_  
CE_  
SOT (SC-70) − DCK  
SOT (SOT-553) − DRL  
Reel of 4000  
SN74LVC1G08DRLR  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
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Copyright 2005, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...16

中文翻译

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