5秒后页面跳转
捷配首页

Datasheet > 逻辑 > 栅极> SN74LVC1G06YEAR
SN74LVC1G06YEAR PDF预览

SN74LVC1G06YEAR

更新时间： 2024-11-01 22:06:43
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
12页 306K
描述
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

阅读下载

中文翻译

获取价格

SN74LVC1G06YEAR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：DSBGA包装说明：VFBGA, BGA5,2X3,20
针数：5Reach Compliance Code：not_compliant
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：5.49系列：LVC/LCX/Z
JESD-30 代码：R-XBGA-B5长度：1.4 mm
逻辑集成电路类型：INVERTER最大I（ol）：0.024 A
功能数量：1输入次数：1
端子数量：5最高工作温度：85 °C
最低工作温度：-40 °C输出特性：OPEN-DRAIN
封装主体材料：UNSPECIFIED封装代码：VFBGA
封装等效代码：BGA5,2X3,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TAPE AND REEL
峰值回流温度（摄氏度）：NOT SPECIFIED电源：3.3 V
传播延迟（tpd）：6.5 ns认证状态：Not Qualified
施密特触发器：NO座面最大高度：0.5 mm
子类别：Gates最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：1.65 V标称供电电压 (Vsup)：1.8 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：0.9 mm
Base Number Matches：1

SN74LVC1G06YEAR 数据手册

 浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第2页浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第3页浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第4页浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第5页浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第6页浏览型号SN74LVC1G06YEAR的Datasheet PDF文件第7页 
SN74LVC1G06  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
SCES295N – JUNE 2000 – REVISED SEPTEMBER 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStarand NanoFreePackages  
Supports 5-V V  
Operation  
CC  
1
2
3
5
4
NC  
A
GND  
V
Y
CC  
Input and Open-Drain Output Accept  
Voltages Up To 5.5 V  
Max t of 4 ns at 3.3 V  
pd  
Low Power Consumption, 10-µA Max I  
NC – No internal connection  
CC  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
24-mA Output Drive at 3.3 V  
I
Supports Partial-Power-Down Mode  
off  
Operation  
3 4  
2
GND  
A
DNU  
Y
V
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
1 5  
CC  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
DNU – Do not use  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single inverter buffer/driver is designed for 1.65-V to 5.5-V V  
operation.  
CC  
NanoStarand NanoFreepackage technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
The output of the SN74LVC1G06 device is open drain and can be connected to other open-drain outputs to  
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
T
A
PACKAGE  
‡
NanoStar– WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC1G06YEAR  
SN74LVC1G06YZAR  
SN74LVC1G06YEPR  
SN74LVC1G06YZPR  
NanoFree– WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
Reel of 3000  
_ _ _CT_  
NanoStar– WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree– WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
Reel of 3000  
Reel of 250  
Reel of 3000  
SN74LVC1G06DBVR  
SN74LVC1G06DBVT  
SN74LVC1G06DCKR  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
C06_  
CT_  
Reel of 250  
SN74LVC1G06DCKT  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code,  
and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition  
(1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...12

中文翻译

下载PDF

SN74LVC1G06YEAR 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVC1G06YZPR TI

完全替代

 SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G06YEPR TI

完全替代

 SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G06YZAR TI

功能相似

 SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

与SN74LVC1G06YEAR相关器件

型号 品牌 获取价格 描述 数据表
SN74LVC1G06YEPR TI

获取价格

 		SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G06YZAR TI

获取价格

 		SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G06YZPR TI

获取价格

 		SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G06YZVR TI

获取价格

 		SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07 TI

获取价格

 		SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07_07 TI

获取价格

 		SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07_08 TI

获取价格

 		SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07_10 TI

获取价格

 		SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07DBVR TI

获取价格

 		SINGLE BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT
SN74LVC1G07DBVR UMW

获取价格

 		逻辑集成电路

与SN74LVC1G06YEAR相关文章

您还可以找


热门产品
PCB打样/小批量
铝基板
BOM智能配单
PCBA制造
钣金
精密CNC
模具注塑
薄膜开关
精选活动
PCBA打样特惠
四六层板品质升级
铝基板品质升级
一体化电子制造
DFM下载
服务支持
企业认证
产品展示
工厂展示
工艺能力
积分商城
关于捷配
捷配简介
企业文化
公司动态
人才招聘
联系我们
帮助中心
下单流程
付款流程
开票流程
常见问题
全球PCB制造服务专线 400-613-0088

工作时间：9:00-21:00

CEO邮箱：ceo@jiepei.com

投诉邮箱：tousu@jiepei.com

捷配网-微信公众号 微信公众号
捷配网-微信公众号 抖音公众号
资质认证：
合作快递：
支付方式：
Copyright © 2024 Jiepei.com Inc. All Rights Reserved. 版权所有:杭州捷配信息科技有限公司 浙公网安备 33010502006866号 浙ICP备10014259号-119 营业执照ICP证