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SN74LVC1G06DBVTE4 PDF预览

SN74LVC1G06DBVTE4

更新时间: 2024-02-25 05:03:04
品牌 Logo 应用领域
德州仪器 - TI 驱动器栅极逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
24页 1195K
描述
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

SN74LVC1G06DBVTE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOT-23
包装说明:LSSOP, TSOP5/6,.11,37针数:5
Reach Compliance Code:unknownHTS代码:8542.39.00.01
Factory Lead Time:1 week风险等级:5.07
系列:LVC/LCX/ZJESD-30 代码:R-PDSO-G5
JESD-609代码:e4长度:2.9 mm
逻辑集成电路类型:INVERTER最大I(ol):0.024 A
湿度敏感等级:1功能数量:1
输入次数:1端子数量:5
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:OPEN-DRAIN封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装等效代码:TSOP5/6,.11,37
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
包装方法:TR峰值回流温度(摄氏度):260
电源:3.3 V传播延迟(tpd):6.5 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:1.45 mm子类别:Gates
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.95 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:1.6 mm
Base Number Matches:1

SN74LVC1G06DBVTE4 数据手册

 浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第2页浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第3页浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第4页浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第5页浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第6页浏览型号SN74LVC1G06DBVTE4的Datasheet PDF文件第7页 
SN74LVC1G06  
www.ti.com  
SCES295V JUNE 2000REVISED NOVEMBER 2012  
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT  
Check for Samples: SN74LVC1G06  
1
FEATURES  
2
Available in the Texas Instruments  
NanoFree™ Package  
Ioff Supports Live Insertion, Partial Power  
Down Mode, and Back Drive Protection  
Supports 5-V VCC Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Input and Open-Drain Output Accept  
Voltages up to 5.5 V  
ESD Protection Exceeds JESD 22  
Max tpd of 4 ns at 3.3 V  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-μA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
DRL PACKAGE  
(TOP VIEW)  
1
2
3
5
4
N.C.  
A
VCC  
1
2
3
5
N.C.  
A
VCC  
1
2
3
N.C.  
A
5
4
VCC  
GND  
Y
4
GND  
Y
GND  
Y
DRY PACKAGE  
(TOP VIEW)  
DSF PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
VCC  
N.C.  
1
2
3
6
5
4
N.C.  
A
VCC  
A
N.C.  
Y
N.C.  
Y
GND  
N.C. – No internal connection  
See mechanical drawings for dimensions.  
GND  
YZP PACKAGE  
(TOP VIEW)  
Table 1. YZP PACKAGE TERMINAL  
ASSIGNMENTS  
A1  
B1  
C1  
A2  
B2  
C2  
1
2
VCC  
No ball  
Y
DNU  
A
VCC  
A
B
C
DNU  
A
GND  
Y
GND  
DNU – Do not use  
YZV PACKAGE  
(TOP VIEW)  
Table 2. YZV PACKAGE TERMINAL  
ASSIGNMENTS  
A1  
B1  
A2  
B2  
1
A
2
VCC  
Y
A
VCC  
Y
A
B
GND  
GND  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2012, Texas Instruments Incorporated  

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