SN74LVC08A-EP
QUADRUPLE 2-INPUT POSITIVE-AND GATE
www.ti.com
SCAS731D–NOVEMBER 2003–REVISED SEPTEMBER 2007
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FEATURES
•
Typical VOLP (Output Ground Bounce) <0.8 V at
VCC = 3.3 V, TA = 25°C
•
Controlled Baseline
•
Typical VOHV (Output VOH Undershoot) >2 V at
VCC = 3.3 V, TA = 25°C
–
–
–
One Assembly
One Test Site
One Fabrication Site
D OR PW PACKAGE
(TOP VIEW)
•
•
Extended Temperature Performance of –40°C
to 125°C and –55°C to 125°C
1
2
3
4
5
6
7
14
13
12
11
10
9
1A
1B
VCC
4B
4A
4Y
3B
3A
3Y
Enhanced Diminishing Manufacturing Sources
(DMS) Support
1Y
2A
2B
2Y
•
•
Enhanced Product-Change Notification
Qualification Pedigree
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification testing
should not be viewed as justifying use of this component beyond
specified
8
GND
performance and environmental limits.
•
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
•
•
•
Operates From 1.65 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 4.1 ns at 3.3 V
DESCRIPTION/ORDERING INFORMATION
The SN74LVC08A quadruple 2-input positive-AND gate is designed for 2.7-V to 3.6-V VCC operation.
Y + A • B or Y + A ) B
The device performs the Boolean function in
positive logic.
Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this device as a translator in
a mixed 3.3 V/5 V system environment.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
SN74LVC08AQDREP
TOP-SIDE MARKING
LVC08AE
SOIC – D
Reel of 2500
–40°C to 125°C
TSSOP – PW
SOIC – D
Reel of 2000
Reel of 2500
Reel of 2000
SN74LVC08AQPWREP
SN74LVC08AMDREP
LVC08AE
LVC08AM
LVC08AM
–55°C to 125°C
TSSOP – PW
SN74LVC08AMPWREP
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.