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SN74LV244DWR PDF预览

SN74LV244DWR

更新时间: 2024-11-28 21:18:07
品牌 Logo 应用领域
德州仪器 - TI 驱动光电二极管逻辑集成电路
页数 文件大小 规格书
10页 241K
描述
Octal Buffer/Driver With 3-State Output 20-SOIC -40 to 85

SN74LV244DWR 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP20,.4针数:20
Reach Compliance Code:not_compliantHTS代码:8542.39.00.01
风险等级:5.81其他特性:TYP VOLP < 0.8V AT VCC = 3.3V, TA = 25 DEGREE C
控制类型:ENABLE LOW系列:LV/LV-A/LVX/H
JESD-30 代码:R-PDSO-G20长度:12.8 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.016 A位数:4
功能数量:2端口数量:2
端子数量:20最高工作温度:85 °C
最低工作温度:-40 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:SOP20,.4
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
包装方法:TAPE AND REEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 VProp。Delay @ Nom-Sup:14 ns
传播延迟(tpd):17 ns认证状态:Not Qualified
座面最大高度:2.65 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.5 mmBase Number Matches:1

SN74LV244DWR 数据手册

 浏览型号SN74LV244DWR的Datasheet PDF文件第2页浏览型号SN74LV244DWR的Datasheet PDF文件第3页浏览型号SN74LV244DWR的Datasheet PDF文件第4页浏览型号SN74LV244DWR的Datasheet PDF文件第5页浏览型号SN74LV244DWR的Datasheet PDF文件第6页浏览型号SN74LV244DWR的Datasheet PDF文件第7页 
SN54LV244, SN74LV244  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCLS194C – FEBRUARY 1993 – REVISED APRIL 1996  
SN54LV244 . . . J OR W PACKAGE  
SN74LV244 . . . DB, DW, OR PW PACKAGE  
(TOP VIEW)  
EPIC (Enhanced-Performance Implanted  
CMOS) 2-µ Process  
Typical V  
< 0.8 V at V , T = 25°C  
(Output Ground Bounce)  
OLP  
CC  
A
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
V
CC  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
Typical V  
> 2 V at V , T = 25°C  
(Output V  
Undershoot)  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
OHV  
CC  
OH  
A
ESD Protection Exceeds 2000 V Per  
MIL-STD-883C, Method 3015; Exceeds  
200 V Using Machine Model  
(C = 200 pF, R = 0)  
13 2A2  
12 1Y4  
Latch-Up Performance Exceeds 250 mA  
Per JEDEC Standard JESD-17  
11  
2A1  
Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), Thin Shrink Small-Outline (PW),  
Ceramic Flat (W) Packages, Chip Carriers  
(FK), and (J) 300-mil DIPs  
SN54LV244 . . . FK PACKAGE  
(TOP VIEW)  
description  
3
2
1
20 19  
18  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
1A2  
2Y3  
1A3  
2Y2  
1A4  
4
5
6
7
8
These octal buffers/line drivers are designed for  
2.7-V to 5.5-V V operation.  
17  
16  
15  
14  
CC  
The ’LV244 are designed specifically to improve  
both the performance and density of 3-state  
memory address drivers, clock drivers, and  
bus-oriented receivers and transmitters.  
9 10 11 12 13  
The ’LV244 are organized as two 4-bit line drivers  
with separate output-enable (OE) inputs. When  
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
The SN74LV244 is available in TI’s shrink small-outline package (DB), which provides the same I/O pin count  
and functionality of standard small-outline packages in less than half the printed-circuit-board area.  
The SN54LV244 is characterized for operation over the full military temperature range of –55°C to 125°C. The  
SN74LV244 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
(each buffer)  
INPUTS  
OUTPUT  
Y
OE  
A
H
L
L
L
H
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC is a trademark of Texas Instruments Incorporated.  
Copyright 1996, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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具有三态输出的八路总线收发器 | DGS | 20 | -40 to 125