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ꢉ ꢅꢆꢊꢋ ꢌꢍꢎ ꢌ ꢏꢆꢐ ꢑꢎ ꢎꢌ ꢐꢌꢍ ꢍꢏꢆ ꢒꢓ ꢌ ꢔ ꢋꢑ ꢓ ꢏꢔ ꢋꢉ ꢓ
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SCLS177E − MARCH 1984 − REVISED AUGUST 2003
SN54HCT574 . . . J OR W PACKAGE
SN74HCT574 . . . DB, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
D
D
Operating Voltage Range of 4.5 V to 5.5 V
High-Current 3-State Noninverting Outputs
Drive Bus Lines Directly or Up To 15 LSTTL
Loads
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
1Q
2Q
1
2
3
4
5
6
7
8
9
20
19
18
D
D
D
D
D
D
Low Power Consumption, 80-µA Max I
CC
Typical t = 22 ns
pd
17 3Q
16 4Q
15 5Q
14 6Q
13 7Q
12 8Q
11 CLK
6-mA Output Drive at 5 V
Low Input Current of 1 µA Max
Inputs Are TTL-Voltage Compatible
Bus-Structured Pinout
description/ordering information
GND 10
These octal edge-triggered D-type flip-flops
feature 3-state outputs designed specifically for
bus driving. The ’HCT574 devices are particularly
suitable for implementing buffer registers, I/O
ports, bidirectional bus drivers, and working
registers.
SN54HCT574 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
2Q
3Q
4Q
3D
4D
5D
6D
7D
4
5
6
7
8
17
16
The eight flip-flops enter data on the low-to-high
transition of the clock (CLK) input.
15 5Q
14
A buffered output-enable (OE) input can be used
to place the eight outputs in either a normal logic
state (high or low logic levels) or the
high-impedance state. In the high-impedance
state, the outputs neither load nor drive the bus
lines significantly. The high-impedance state and
increased drive provide the capability to drive bus
lines without interface or pullup components.
6Q
9 10 11 12 13
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
Tube of 20
Tube of 25
Reel of 2000
Reel of 2000
Reel of 2000
Tube of 70
Reel of 2000
Reel of 250
Tube of 20
Tube of 85
Tube of 55
SN74HCT574N
SN74HCT574N
SN74HCT574DW
SN74HCT574DWR
SN74HCT574NSR
SN74HCT574DBR
SN74HCT574PW
SN74HCT574PWR
SN74HCT574PWT
SNJ54HCT574J
SOIC − DW
HCT574
SOP − NS
HCT574
HT574
−40°C to 85°C
SSOP − DB
TSSOP − PW
HT574
CDIP − J
CFP − W
LCCC − FK
SNJ54HCT574J
SNJ54HCT574W
SNJ54HCT574FK
SNJ54HCT574W
SNJ54HCT574FK
−55°C to 125°C
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
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