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SN74CBTLV16211C PDF预览

SN74CBTLV16211C

更新时间: 2024-10-31 05:17:35
品牌 Logo 应用领域
德州仪器 - TI 开关
页数 文件大小 规格书
11页 304K
描述
LOW-VOLTAGE 24-BIT FET BUS SWITCH

SN74CBTLV16211C 数据手册

 浏览型号SN74CBTLV16211C的Datasheet PDF文件第2页浏览型号SN74CBTLV16211C的Datasheet PDF文件第3页浏览型号SN74CBTLV16211C的Datasheet PDF文件第4页浏览型号SN74CBTLV16211C的Datasheet PDF文件第5页浏览型号SN74CBTLV16211C的Datasheet PDF文件第6页浏览型号SN74CBTLV16211C的Datasheet PDF文件第7页 
ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇꢈ ꢉꢊ ꢋꢉꢉꢄ  
ꢇ ꢌ ꢍꢎꢈꢌ ꢇꢆꢏꢐ ꢑ ꢋ ꢃ ꢎꢅꢒ ꢆ ꢓ ꢑꢆ ꢅꢔꢀ ꢀ ꢍꢒ ꢆꢄ ꢕ  
SCDS204 − JULY 2005  
D
D
D
D
Member of the Texas Instruments  
WidebusFamily  
5-Switch Connection Between Two Ports  
Rail-to-Rail Switching on Data I/O Ports  
D
D
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
I
Supports Partial-Power-Down Mode  
off  
Operation  
description/ordering information  
The SN74CBTLV16211C provides 24 bits of high-speed bus switching. The low on-state resistance of the switch  
allows connections to be made with minimal propagation delay.  
The device is organized as dual 12-bit bus switches with separate output-enable (OE) inputs. It can be used  
as two 12-bit bus switches or as one 24-bit bus switch. When OE is low, the associated 12-bit bus switch is on,  
and port A is connected to port B. When OE is high, the switch is open, and the high-impedance state exists  
between the two ports.  
This device is fully specified for partial-power-down applications using I . The I feature ensures that  
off  
off  
damaging current will not backflow through the device when it is powered down. The device has isolation during  
power off.  
To ensure the high-impedance state during power up or power down, OE should be tied to V  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup  
CC  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
VFBGA − GRD  
VFBGA − ZRD (Pb-free)  
Tape and reel  
Tape and reel  
74CBTLV16211CGRDR  
74CBTLV16211CZRDR  
−40°C to 85°C  
CN211  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢆꢤ  
Copyright 2005, Texas Instruments Incorporated  
ꢠ ꢤ ꢡ ꢠꢙ ꢚꢮ ꢜꢛ ꢟ ꢧꢧ ꢥꢟ ꢝ ꢟ ꢞ ꢤ ꢠ ꢤ ꢝ ꢡ ꢩ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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