ꢀꢁ ꢂꢃ ꢄꢅ ꢆꢇ ꢆꢆ ꢈꢃ
ꢉ ꢊ ꢋꢅꢌ ꢇ ꢍ ꢎꢇ ꢅꢏ ꢀ ꢀ ꢐꢌ ꢇꢄ ꢑ
ꢌꢇ ꢑ ꢔ ꢋꢕꢋꢇꢘ ꢗ ꢎꢛꢙꢁꢇ ꢗ ꢎꢕꢎ ꢗ ꢀ ꢑꢌ ꢍꢇ ꢎꢛ
ꢒ
ꢓ
ꢔ
ꢋ
ꢕꢖ
ꢆ
ꢓ
ꢆ
ꢋ
ꢕ
ꢗ
ꢘ
ꢐ
ꢋ
ꢕ
ꢘ
ꢗ
ꢇ
ꢙ
ꢚ
ꢎ
ꢅ
ꢏ
ꢀ
ꢀ
ꢐ
ꢌ
ꢇ
ꢄ
ꢑ
ꢐ
SCDS159B − OCTOBER 2003 − REVISED MARCH 2004
D
D
Output Voltage Translation Tracks V
D
D
V
Operating Range From 2.3 V to 3.6 V
CC
CC
Supports Mixed-Mode Signal Operation On
All Data I/O Ports
− 5-V Input Down To 3.3-V Output Level
Data I/Os Support 0 to 5-V Signaling Levels
(For Example: 0.8-V, 1.2-V, 1.5-V, 1.8-V,
2.5-V, 3.3-V, 5-V)
Shift With 3.3-V V
− 5-V/3.3-V Input Down To 2.5-V Output
Level Shift With 2.5-V V
CC
D
D
D
D
Control Inputs Can Be Driven by TTL or
5-V/3.3-V/2.5-V CMOS Outputs
CC
I
Supports Partial-Power-Down Mode
off
D
D
D
D
D
D
5-V-Tolerant I/Os With Device Powered-Up
or Powered-Down
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
Bidirectional Data Flow, With Near-Zero
Propagation Delay
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
Low ON-State Resistance (r
)
on
Characteristics (r = 5 Ω Typical)
on
Low Input/Output Capacitance Minimizes
− 1000-V Charged-Device Model (C101)
Loading (C
= 5 pF Typical)
io(OFF)
D
D
Supports Digital Applications: Level
Translation, Memory Interleaving, Bus
Isolation
Data and Control Inputs Provide
Undershoot Clamp Diodes
Low Power Consumption
Ideal for Low-Power Portable Equipment
(I
= 40 µA Max)
CC
DBQ, DGV, DW, OR PW PACKAGE
(TOP VIEW)
1
24
23
22
21
20
19
18
17
16
15
14
13
1OE
1B1
1A1
1A2
1B2
1B3
1A3
1A4
1B4
1B5
1A5
GND
V
CC
2
2B5
2A5
2A4
2B4
2B3
2A3
2A2
2B2
2B1
2A1
2OE
3
4
5
6
7
8
9
10
11
12
description/ordering information
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
SN74CB3T3384DW
SN74CB3T3384DWR
SN74CB3T3384DBQR
SN74CB3T3384PW
SN74CB3T3384PWR
SN74CB3T3384DGVR
Tube
SOIC − DW
CB3T3384
CB3T3384
Tape and reel
Tape and reel
Tube
SSOP (QSOP) − DBQ
−40°C to 85°C
TSSOP − PW
TVSOP − DGV
KS384
Tape and reel
Tape and reel
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢜ
ꢜ
ꢛ
ꢘ
ꢭ
ꢝ
ꢨ
ꢏ
ꢄ
ꢦ
ꢇ
ꢧ
ꢌ
ꢡ
ꢘ
ꢟ
ꢁ
ꢠ
ꢝ
ꢙ
ꢇ
ꢙ
ꢞ
ꢟ
ꢩ
ꢠ
ꢡ
ꢧ
ꢢ
ꢣ
ꢤ
ꢤ
ꢥ
ꢥ
ꢞ
ꢞ
ꢡ
ꢡ
ꢟ
ꢟ
ꢞ
ꢦ
ꢦ
ꢪ
ꢧ
ꢨ
ꢢ
ꢢ
ꢩ
ꢩ
ꢟ
ꢥ
ꢤ
ꢣ
ꢦ
ꢦ
ꢡ
ꢠ
ꢪ
ꢇꢩ
ꢨ
ꢫ
ꢦ
ꢬ
ꢞ
ꢧ
ꢤ
ꢦ
ꢥ
ꢞ
ꢥ
ꢡ
ꢢ
ꢟ
ꢨ
ꢭ
ꢤ
ꢟ
ꢥ
ꢥ
ꢩ
ꢦ
ꢓ
Copyright 2004, Texas Instruments Incorporated
ꢢ
ꢡ
ꢧ
ꢥ
ꢡ
ꢢ
ꢣ
ꢥ
ꢡ
ꢦ
ꢪ
ꢞ
ꢠ
ꢞ
ꢧ
ꢩ
ꢢ
ꢥ
ꢮ
ꢥ
ꢩ
ꢢ
ꢡ
ꢠ
ꢯ
ꢤ
ꢌ
ꢟ
ꢣ
ꢩ
ꢦ
ꢥ
ꢤ
ꢟ
ꢭ
ꢤ
ꢢ
ꢭ
ꢰ
ꢤ
ꢥ ꢩ ꢦ ꢥꢞ ꢟꢲ ꢡꢠ ꢤ ꢬꢬ ꢪꢤ ꢢ ꢤ ꢣ ꢩ ꢥ ꢩ ꢢ ꢦ ꢓ
ꢢ
ꢢ
ꢤ
ꢟ
ꢥ
ꢱ
ꢓ
ꢜ
ꢢ
ꢡ
ꢭ
ꢨ
ꢧ
ꢥ
ꢞ
ꢡ
ꢟ
ꢪ
ꢢ
ꢡ
ꢧ
ꢩ
ꢦ
ꢦ
ꢞ
ꢟ
ꢲ
ꢭ
ꢡ
ꢩ
ꢦ
ꢟ
ꢡ
ꢥ
ꢟ
ꢩ
ꢧ
ꢩ
ꢦ
ꢦ
ꢤ
ꢢ
ꢞ
ꢬ
ꢱ
ꢞ
ꢟ
ꢧ
ꢬ
ꢨ
ꢭ
ꢩ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265