SN74BCT760-EP
OCTAL BUFFER/DRIVER
WITH OPEN-COLLECTOR OUTPUTS
www.ti.com
SCBS817B–JULY 2006–REVISED SEPTEMBER 2006
FEATURES
•
Controlled Baseline
DW PACKAGE
(TOP VIEW)
– One Assembly/Test Site, One Fabrication
Site
1
2
3
4
5
6
7
8
9
10
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
20 VCC
•
•
Extended Temperature Performance of –55°C
to 125°C
19
18
17
16
15
14
13
12
11
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
Enhanced Diminishing Manufacturing
Sources (DMS) Support
•
•
•
•
Enhanced Product-Change Notification
(1)
Qualification Pedigree
Open-Collector Version of 'BCT244
Open-Collector Outputs Drive Bus Lines or
Buffer Memory Address Registers
•
•
ESD Protection Exceeds 2000 V Per
MIL-STD-883C Method 3015
Available In Plastic Small-Outline (DW)
Package
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74BCT760 octal buffer and line driver is designed specifically to improve both the performance and
density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The SN74BCT760 is organized as two 4-bit buffers/line drivers with separate output-enable (OE) inputs. When
OE is low, the device passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
The device is characterized for operation over the full military temperature range of –55°C to 125°C.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
BCT760MEP
–55°C to 125°C
SOIC – DW
Tape and reel
SN74BCT760MDWREP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
L
A
H
L
H
L
L
H
X
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.