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SN74BCT29827BDWE4 PDF预览

SN74BCT29827BDWE4

更新时间: 2024-11-14 00:01:19
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件信息通信管理
页数 文件大小 规格书
9页 250K
描述
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

SN74BCT29827BDWE4 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:PLASTIC, SO-24针数:24
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.56Is Samacsys:N
其他特性:WITH DUAL OUTPUT ENABLE控制类型:ENABLE LOW
系列:BCT/FBTJESD-30 代码:R-PDSO-G24
JESD-609代码:e4长度:15.4 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.048 A湿度敏感等级:1
位数:10功能数量:1
端口数量:2端子数量:24
最高工作温度:70 °C最低工作温度:
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP24,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE包装方法:TUBE
峰值回流温度(摄氏度):260最大电源电流(ICC):40 mA
Prop。Delay @ Nom-Sup:7.5 ns传播延迟(tpd):7.5 ns
认证状态:Not Qualified座面最大高度:2.65 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.5 mmBase Number Matches:1

SN74BCT29827BDWE4 数据手册

 浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第2页浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第3页浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第4页浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第5页浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第6页浏览型号SN74BCT29827BDWE4的Datasheet PDF文件第7页 
SN54BCT29827B, SN74BCT29827B  
10-BIT BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCBS008C – APRIL 1987 – REVISED NOVEMBER 1993  
SN54BCT29827B . . . JT OR W PACKAGE  
SN74BCT29827B . . . DW OR NT PACKAGE  
(TOP VIEW)  
State-of-the-Art BiCMOS Design  
Significantly Reduces I  
CCZ  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883C, Method 3015; Exceeds  
200 V Using Machine Model (C = 200 pF,  
R = 0)  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
OE1  
A1  
V
CC  
2
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
Y9  
Y10  
OE2  
3
A2  
A3  
A4  
A5  
3-State Outputs Drive Bus Lines or Buffer  
4
Memory Address Registers  
5
6
P-N-P Inputs Reduce DC Loading  
7
A6  
A7  
A8  
A9  
Flow-Through Architecture Optimizes  
8
PCB Layout  
9
Package Options Include Plastic  
Small-Outline (DW) Packages, Ceramic Chip  
Carriers (FK) and Flatpacks (W), and  
Standard Plastic and Ceramic 300-mil DIPs  
(JT, NT)  
10  
11  
12  
A10  
GND  
SN54BCT29827B . . . FK PACKAGE  
(TOP VIEW)  
description  
These 10-bit buffers and bus drivers provide  
high-performance bus interface for wide data  
paths or buses carrying parity.  
4
3
2
1
28 27 26  
25  
5
6
7
8
9
Y3  
Y4  
Y5  
A3  
A4  
A5  
NC  
A6  
A7  
A8  
The 3-state control gate is a 2-input AND gate with  
active-low inputs so that if either output-enable  
(OE1 or OE2) input is high, all ten outputs are in  
the high-impedance state. The outputs are also in  
the high-impedance state during power-up and  
power-down conditions. The outputs remain in the  
high-impedance state while the device is powered  
down.  
24  
23  
22 NC  
21 Y6  
20 Y7  
19 Y8  
10  
11  
12 13 14 15 16 17 18  
The SN54BCT29827B is characterized for  
operation over the full military temperature range  
of 55°C to 125°C. The SN74BCT29827B is  
characterized for operation from 0°C to 70°C.  
NC – No internal connection  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
OE1  
L
OE2  
L
A
L
L
H
Z
Z
L
L
H
X
X
H
X
X
H
Copyright 1993, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
2–1  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74BCT29827BDWE4 替代型号

型号 品牌 替代类型 描述 数据表
SN74BCT29827BDWR TI

完全替代

10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
SN74BCT29827BDW TI

完全替代

10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS
SN74BCT29827BNT TI

完全替代

10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

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