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SN74AUP3G06DCUR PDF预览

SN74AUP3G06DCUR

更新时间: 2024-11-16 06:12:55
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器触发器逻辑集成电路光电二极管输出元件
页数 文件大小 规格书
13页 276K
描述
LOW-POWER TRIPLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUP3G06DCUR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:VSSOP, TSSOP8,.12,20针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.65计数方向:UNIDIRECTIONAL
系列:AUP/ULP/VJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:2.3 mm
负载电容(CL):30 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.004 A湿度敏感等级:1
位数:1功能数量:3
端口数量:2端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:OPEN-DRAIN输出极性:INVERTED
封装主体材料:PLASTIC/EPOXY封装代码:VSSOP
封装等效代码:TSSOP8,.12,20封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH包装方法:TR
峰值回流温度(摄氏度):260电源:1.2/3.3 V
最大电源电流(ICC):0.0009 mAProp。Delay @ Nom-Sup:19.3 ns
传播延迟(tpd):19.3 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:0.9 mm
子类别:Gates最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):0.8 V标称供电电压 (Vsup):1.2 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
翻译:N/A宽度:2 mm
Base Number Matches:1

SN74AUP3G06DCUR 数据手册

 浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第2页浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第3页浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第4页浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第5页浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第6页浏览型号SN74AUP3G06DCUR的Datasheet PDF文件第7页 
SN74AUP3G06  
www.ti.com  
SCES775A DECEMBER 2009REVISED DECEMBER 2009  
LOW-POWER TRIPLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS  
Check for Samples: SN74AUP3G06  
1
FEATURES  
Available in the Texas Instruments NanoStar™  
Package  
Optimized for 3.3-V Operation  
3.6-V I/O Tolerant to Support Mixed-Mode  
Signal Operation  
Low Static-Power Consumption  
(ICC = 0.9 μA Maximum)  
tpd = 4.3 ns Maximum at 3.3 V  
Low Dynamic-Power Consumption  
(Cpd = 4.3 pF Typ at 3.3 V)  
Suitable for Point-to-Point Applications  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Input Capacitance (Ci = 1.5 pF Typical)  
Low Noise – Overshoot and Undershoot  
<10% of VCC  
ESD Performance Tested Per JESD 22  
2000-V Human-Body Model  
(A114-B, Class II)  
Ioff Supports Partial-Power-Down Mode  
Operation  
1000-V Charged-Device Model (C101)  
Wide Operating VCC Range of 0.8 V to 3.6 V  
DCU PACKAGE  
(TOP VIEW)  
DQE PACKAGE  
(TOP VIEW)  
RSE PACKAGE  
(TOP VIEW)  
YFP PACKAGE  
(TOP VIEW)  
VCC  
VCC  
1
2
3
4
8
7
6
5
1A  
3Y  
A1  
B1  
C1  
D1  
A2  
B2  
C2  
D2  
VCC  
1 8  
2 7  
3 6  
4 5  
VCC  
1Y  
3A  
2Y  
1
2
3
4
8
7
6
5
1A  
3Y  
1A  
3Y  
1Y  
3A  
2Y  
1Y  
3A  
2Y  
8
1
2
3
7
6
5
1Y  
3A  
2Y  
1A  
3Y  
2A  
2A  
2A  
2A  
GND  
GND  
GND  
4
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
The AUP family is TI's premier solution to the industry's low-power needs in battery-powered portable  
applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range  
of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal  
integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).  
Static-Power Consumption  
(µA)  
Dynamic-Power Consumption  
(pF)  
Switching Characteristics  
at 25 MHz(A)  
100%  
80%  
60%  
40%  
20%  
0%  
100%  
80%  
60%  
40%  
20%  
0%  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
-0.5  
Input  
Output  
3.3-V  
Logic(A)  
3.3-V  
Logic(A)  
AUP  
AUP  
(A)  
20  
25  
Time (ns)  
10 15  
0
5
35 40 45  
30  
Single, dual, and triple gates  
(A) SN74AUP3Gxx data at C = 15 pF.  
L
Figure 1. AUP – The Lowest-Power Family  
Figure 2. Excellent Signal Integrity  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  
 

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