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SN74AUP1G06YFPR PDF预览

SN74AUP1G06YFPR

更新时间: 2024-02-23 18:43:48
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
21页 927K
描述
LOW-POWER SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

SN74AUP1G06YFPR 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:SOT-23包装说明:LSSOP, BGA4,2X3,20
针数:5Reach Compliance Code:compliant
HTS代码:8542.39.00.01风险等级:5.33
系列:AUP/ULP/VJESD-30 代码:S-XBGA-B4
长度:0.77 mm负载电容(CL):30 pF
逻辑集成电路类型:INVERTER最大I(ol):0.0017 A
功能数量:1输入次数:1
端子数量:4最高工作温度:85 °C
最低工作温度:-40 °C输出特性:OPEN-DRAIN
封装主体材料:PLASTIC/EPOXY封装代码:LSSOP
封装等效代码:BGA4,2X3,20封装形状:SQUARE
封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法:TR
峰值回流温度(摄氏度):NOT SPECIFIED电源:1.2/3.3 V
Prop。Delay @ Nom-Sup:19.3 ns传播延迟(tpd):19.3 ns
认证状态:Not Qualified施密特触发器:NO
座面最大高度:0.5 mm子类别:Gates
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):0.8 V
标称供电电压 (Vsup):1.2 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子形式:GULL WING端子节距:0.95 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4 mmBase Number Matches:1

SN74AUP1G06YFPR 数据手册

 浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第2页浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第3页浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第4页浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第5页浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第6页浏览型号SN74AUP1G06YFPR的Datasheet PDF文件第7页 
SN74AUP1G06  
www.ti.com  
SCES590D JULY 2004REVISED MAY 2010  
LOW-POWER SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
Check for Samples: SN74AUP1G06  
1
FEATURES  
Available in the Texas Instruments NanoStar™  
Package  
Input (Vhys = 250 mV Typ at 3.3 V)  
Wide Operating VCC Range of 0.8 V to 3.6 V  
Optimized for 3.3-V Operation  
Low Static-Power Consumption  
(ICC = 0.9 mA Max)  
3.6-V I/O Tolerant to Support Mixed-Mode  
Signal Operation  
Low Dynamic-Power Consumption  
(Cpd = 1 pF Typ at 3.3 V)  
tpd = 3.6 ns Max at 3.3 V  
Low Input Capacitance (Ci = 1.5 pF Typ)  
Suitable for Point-to-Point Applications  
Low Noise – Overshoot and Undershoot <10%  
of VCC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Ioff Supports Partial Power-Down-Mode  
Operation  
ESD Performance Tested Per JESD 22  
2000-V Human-Body Model  
(A114-B, Class II)  
Input Hysteresis Allows Slow Input Transition  
and Better Switching Noise Immunity at the  
1000-V Charged-Device Model (C101)  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
VCC  
1
2
3
5
4
N.C.  
A
VCC  
1
2
3
5
N.C.  
A
GND  
Y
4
GND  
Y
DRY PACKAGE  
(TOP VIEW)  
DSF PACKAGE  
(TOP VIEW)  
YFP PACKAGE  
(TOP VIEW)  
1
2
3
6
5
4
1
2
3
6
5
4
A2  
A1  
B1  
1
2
4
3
VCC  
Y
N.C.  
A
VCC  
N.C.  
Y
N.C.  
A
V
A
CC  
B2  
GND  
N.C.  
Y
GND  
GND  
See mechanical drawings for dimensions.  
N.C. – No internal connection  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2010, Texas Instruments Incorporated  

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