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SN74AUC2G07

更新时间： 2024-11-05 22:49:31
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
11页 297K
描述
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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SN74AUC2G07 数据手册

 浏览型号SN74AUC2G07的Datasheet PDF文件第2页浏览型号SN74AUC2G07的Datasheet PDF文件第3页浏览型号SN74AUC2G07的Datasheet PDF文件第4页浏览型号SN74AUC2G07的Datasheet PDF文件第5页浏览型号SN74AUC2G07的Datasheet PDF文件第6页浏览型号SN74AUC2G07的Datasheet PDF文件第7页 
SN74AUC2G07  
DUAL BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
www.ti.com  
SCES443A–MAY 2003–REVISED MARCH 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
V
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
CC  
2Y  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
YEP OR YZP PACKAGE  
(BOTTOM VIEW)  
•
•
•
•
•
Sub-1-V Operable  
Max tpd of 2.5 ns at 1.8 V  
3
2
1
4
5
6
2A  
GND  
1A  
2Y  
V
CC  
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
1Y  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This dual buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC  
operation.  
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
Tape and reel  
Tape and reel  
SN74AUC2G07YEPR  
_ _ _UV_  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74AUC2G07YZPR  
–40°C to 85°C  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Tape and reel  
Tape and reel  
SN74AUC2G07DBVR  
SN74AUC2G07DCKR  
U07_  
UV_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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SN74AUC2G07 替代型号

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