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SN74AUC2G06YZPR PDF预览

SN74AUC2G06YZPR

更新时间： 2024-11-24 03:57:23
品牌 Logo 应用领域
德州仪器 - TI 驱动器逻辑集成电路输出元件
页数 文件大小 规格书
13页 341K
描述
DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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SN74AUC2G06YZPR 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：BGA
包装说明：VFBGA, BGA6,2X3,20针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01风险等级：1.56
系列：AUCJESD-30 代码：R-XBGA-B6
JESD-609代码：e1长度：1.4 mm
负载电容（CL）：15 pF逻辑集成电路类型：INVERTER
最大I（ol）：0.009 A湿度敏感等级：1
功能数量：2输入次数：1
端子数量：6最高工作温度：85 °C
最低工作温度：-40 °C输出特性：OPEN-DRAIN
封装主体材料：UNSPECIFIED封装代码：VFBGA
封装等效代码：BGA6,2X3,20封装形状：RECTANGULAR
封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：1.2/2.5 V
最大电源电流（ICC）：0.01 mAProp。Delay @ Nom-Sup：3.3 ns
传播延迟（tpd）：3.3 ns认证状态：Not Qualified
施密特触发器：NO座面最大高度：0.5 mm
子类别：Gates最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.2 V
表面贴装：YES技术：CMOS
温度等级：INDUSTRIAL端子面层：Tin/Silver/Copper (Sn/Ag/Cu)
端子形式：BALL端子节距：0.5 mm
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
宽度：0.9 mmBase Number Matches：1

SN74AUC2G06YZPR 数据手册

 浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第2页浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第3页浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第4页浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第5页浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第6页浏览型号SN74AUC2G06YZPR的Datasheet PDF文件第7页 
SN74AUC2G06  
DUAL INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUTS  
www.ti.com  
SCES442C–MAY 2003–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
Low Power Consumption, 10 µA at 1.8 V  
±8-mA Output Drive at 1.8 V  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
•
•
Sub-1-V Operable  
1000-V Charged-Device Model (C101)  
Max tpd of 2.5 ns at 1.8 V  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
2
1
4
5
6
2A  
GND  
1A  
2Y  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
VCC  
VCC  
1Y  
VCC  
2Y  
2Y  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to  
1.95-V VCC operation.  
The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to  
implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
SN74AUC2G06YZPR  
_ _ _UT_  
–40°C to 85°C  
Reel of 3000  
Reel of 3000  
SN74AUC2G06DBVR  
SN74AUC2G06DCKR  
U06_  
UT_  
SOT (SC-70) – DCK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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