Datasheet > SN74AUC2G06_09

SN74AUC2G06_09

更新时间： 2024-11-27 09:15:23

品牌	Logo	应用领域
德州仪器 - TI		驱动器输出元件
页数	文件大小	规格书
13页	570K
描述
DUAL INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS

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SN74AUC2G06_09 数据手册

SN74AUC2G06

DUAL INVERTER BUFFER/DRIVER

WITH OPEN-DRAIN OUTPUTS

www.ti.com

SCES442C–MAY 2003–REVISED JANUARY 2007

FEATURES

•

Available in the Texas Instruments

NanoFree™ Package

•

Low Power Consumption, 10 µA at 1.8 V

±8-mA Output Drive at 1.8 V

•

Optimized for 1.8-V Operation and Is 3.6-V I/O

Tolerant to Support Mixed-Mode Signal

Operation

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

•

ESD Protection Exceeds JESD 22

•

I_offSupports Partial-Power-Down Mode

Operation

–

2000-V Human-Body Model (A114-A)

200-V Machine Model (A115-A)

•

Sub-1-V Operable

1000-V Charged-Device Model (C101)

Max t_pdof 2.5 ns at 1.8 V

DBV PACKAGE

(TOP VIEW)

DCK PACKAGE

(TOP VIEW)

YZP PACKAGE

(BOTTOM VIEW)

GND

V_CC

See mechanical drawings for dimensions.

DESCRIPTION/ORDERING INFORMATION

This dual inverter buffer/driver is operational at 0.8-V to 2.7-V V_CC, but is designed specifically for 1.65-V to

1.95-V V_CCoperation.

The output of the SN74AUC2G06 device is open drain and can be connected to other open-drain outputs to

implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

This device is fully specified for partial-power-down applications using I_off. The I_offcircuitry disables the outputs,

preventing damaging current backflow through the device when it is powered down.

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾

ORDERABLE PART NUMBER

TOP-SIDE MARKING⁽²⁾

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP (Pb-free)

SOT (SOT-23) – DBV

Reel of 3000

SN74AUC2G06YZPR

_ _ _UT_

–40°C to 85°C

Reel of 3000

SN74AUC2G06DBVR

SN74AUC2G06DCKR

U06_

UT_

SOT (SC-70) – DCK

(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

12 3 4 5 6 7...13

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