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SN74AUC1G66YEAR PDF预览

SN74AUC1G66YEAR

更新时间： 2024-09-08 22:19:51
品牌 Logo 应用领域
德州仪器 - TI 复用器开关复用器或开关信号电路
页数 文件大小 规格书
15页 295K
描述
SINGLE BILATERAL ANALOG SWITCH

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SN74AUC1G66YEAR 技术参数

是否Rohs认证： 不符合生命周期：Obsolete
零件包装代码：BGA包装说明：DSBGA-5
针数：5Reach Compliance Code：not_compliant
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：5.33Is Samacsys：N
模拟集成电路 - 其他类型：SPSTJESD-30 代码：R-XBGA-B5
长度：1.4 mm正常位置：NO
信道数量：1功能数量：1
端子数量：5标称断态隔离度：55 dB
最大通态电阻 (Ron)：20 Ω最高工作温度：85 °C
最低工作温度：-40 °C封装主体材料：UNSPECIFIED
封装代码：VFBGA封装等效代码：BGA5,2X3,20
封装形状：RECTANGULAR封装形式：GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度（摄氏度）：NOT SPECIFIED电源：1.2/2.5 V
认证状态：Not Qualified座面最大高度：0.5 mm
子类别：Multiplexer or Switches最大供电电压 (Vsup)：2.7 V
最小供电电压 (Vsup)：0.8 V标称供电电压 (Vsup)：1.65 V
表面贴装：YES最长断开时间：2.9 ns
最长接通时间：1.1 ns技术：CMOS
温度等级：INDUSTRIAL端子形式：BALL
端子节距：0.5 mm端子位置：BOTTOM
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：0.9 mm
Base Number Matches：1

SN74AUC1G66YEAR 数据手册

 浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第2页浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第3页浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第4页浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第5页浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第6页浏览型号SN74AUC1G66YEAR的Datasheet PDF文件第7页 
SN74AUC1G66  
SINGLE BILATERAL ANALOG SWITCH  
SCES386F – MARCH 2002 – REVISED APRIL 2003  
DBV OR DCK PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar and NanoFree Packages  
Optimized for 1.8-V Operation and Is 3.6-V  
I/O Tolerant to Support Mixed-Mode Signal  
Operation  
1
2
3
A
B
GND  
V
CC  
5
4
C
Sub 1-V Operable  
Low Power Consumption, 10-µA Max I  
High On-Off Output Voltage Ratio  
High Degree of Linearity  
CC  
YEA OR YZA PACKAGE  
(BOTTOM VIEW)  
3 4  
2
GND  
B
C
High Speed – Max 0.2 ns (V  
= 1.8 V,  
CC  
C = 15 pF)  
L
1 5  
A
V
CC  
Low On-State Impedance – Typically ≈9 Ω  
(V = 2.3 V)  
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
description/ordering information  
This single analog switch is operational at 0.8-V to 2.7-V V , but is designed specifically for 1.65-V to 1.95-V  
CC  
V
operation.  
CC  
The SN74AUC1G66 can handle both analog and digital signals. It permits signals with amplitudes of up to 3.6-V  
(peak) to be transmitted in either direction.  
NanoStar and NanoFree package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for  
analog-to-digital and digital-to-analog conversion systems.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
†
PACKAGE  
T
A
‡
NanoStar  
WCSP (DSBGA) – YEA  
Tape and reel  
Tape and reel  
SN74AUC1G66YEAR  
SN74AUC1G66YZAR  
_ _ _U6_  
NanoFree  
–40°C to 85°C  
WCSP (DSBGA) – YZA (Pb-free)  
SOT (SOT-23) – DBV  
Tape and reel  
Tape and reel  
SN74AUC1G66DBVR  
SN74AUC1G66DCKR  
U66_  
U6_  
SOT (SC-70) – DCK  
†
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar and NanoFree are trademarks of Texas Instruments.  
Copyright 2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...15

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