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SN74AUC1G06 PDF预览

SN74AUC1G06

更新时间： 2024-10-31 21:53:59
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 330K
描述
SINGLE INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUT

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SN74AUC1G06 数据手册

 浏览型号SN74AUC1G06的Datasheet PDF文件第2页浏览型号SN74AUC1G06的Datasheet PDF文件第3页浏览型号SN74AUC1G06的Datasheet PDF文件第4页浏览型号SN74AUC1G06的Datasheet PDF文件第5页浏览型号SN74AUC1G06的Datasheet PDF文件第6页浏览型号SN74AUC1G06的Datasheet PDF文件第7页 
SN74AUC1G06  
SINGLE INVERTER BUFFER/DRIVER  
WITH OPEN-DRAIN OUTPUT  
www.ti.com  
SCES372J–SEPTEMBER 2001–REVISED JUNE 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
5
4
NC  
A
V
Y
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
CC  
GND  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
NC - No internal connection  
•
•
•
•
•
Sub-1-V Operable  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Max tpd of 2.5 ns at 1.8 V  
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
3 4  
2
GND  
A
Y
V
1 5  
DNU  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
CC  
DNU - Do not use  
•
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This single inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to  
1.95-V VCC operation.  
The output of the SN74AUC1G06 is open drain and can be connected to other open-drain outputs to implement  
active-low wired-OR or active-high wired-AND functions.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74AUC1G06YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA  
(Pb-free)  
SN74AUC1G06YZAR  
SN74AUC1G06YEPR  
SN74AUC1G06YZPR  
Tape and reel  
_ _ _UT_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
(Pb-free)  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
Tape and reel SN74AUC1G06DBVR  
Tape and reel SN74AUC1G06DCKR  
U06_  
UT_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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SN74AUC1G06 替代型号

型号 品牌 替代类型 描述 数据表
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