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SN74AUC126

更新时间： 2024-11-20 03:57:27
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德州仪器 - TI 输出元件
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13页 551K
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QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS

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SN74AUC126 数据手册

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SN74AUC126  
QUADRUPLE BUS BUFFER GATE  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCES509–NOVEMBER 2003–REVISED DECEMBER 2005  
FEATURES  
RGY PACKAGE  
(TOP VIEW)  
•
Optimized for 1.8-V Operation and Is 3.6-V I/O  
Tolerant to Support Mixed-Mode Signal  
Operation  
•
Ioff Supports Partial-Power-Down Mode  
Operation  
1
14  
1A  
1Y  
13 4OE  
2
3
4
5
6
•
•
•
•
•
Sub 1-V Operable  
12  
11  
10  
9
4A  
2OE  
2A  
4Y  
3OE  
3A  
Max tpd of 2.1 ns at 1.8 V  
Low Power Consumption, 10-µA Max ICC  
±8-mA Output Drive at 1.8 V  
2Y  
7
8
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
•
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
– 1500-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This quadruple bus buffer gate is designed for 0.8-V to 2.7-V VCC operation, but is designed specifically for 1.6-V  
to 1.95-V VCC operation.  
The SN74AUC126 contains four independent line drivers with 3-state outputs. Each output is disabled when the  
associated output-enable (OE) input is low.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–40°C to 85°C  
QFN – RGY  
Tape and reel  
SN74AUC126RGYR  
MS126  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
OE  
H
A
H
L
H
L
H
L
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2003–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...13

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