SN54ALVTH16827, SN74ALVTH16827
2.5-V/3.3-V 20-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCES076E – JULY 1996 – REVISED DECEMBER 1998
SN54ALVTH16827 . . . WD PACKAGE
SN74ALVTH16827 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
State-of-the-Art Advanced BiCMOS
Technology (ABT) Widebus Design for
2.5-V and 3.3-V Operation and Low Static
Power Dissipation
1OE1
1Y1
1Y2
GND
1Y3
1Y4
1OE2
1A1
1A2
GND
1A3
1A4
1
2
3
4
5
6
7
8
9
56
55
54
53
52
51
50
49
48
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V V
)
CC
Typical V
< 0.8 V at V
(Output Ground Bounce)
OLP
= 3.3 V, T = 25°C
CC
A
V
V
High Drive (–24/24 mA at 2.5-V and
–32/64 mA at 3.3-V V
CC
CC
1Y5
1Y6
1A5
1A6
)
CC
Power Off Disables Outputs, Permitting
Live Insertion
1Y7 10
47 1A7
GND
1Y8
GND
1A8
11
12
46
45
High-Impedance State During Power Up
and Power Down Prevents Driver Conflict
1Y9 13
1Y10 14
2Y1 15
2Y2 16
2Y3 17
GND 18
2Y4 19
2Y5 20
2Y6 21
44 1A9
43 1A10
42 2A1
41 2A2
40 2A3
39 GND
38 2A4
37 2A5
36 2A6
Uses Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
Auto3-State Eliminates Bus Current
Loading When Output Exceeds V
+ 0.5 V
CC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model; and Exceeds 1000 V
Using Charged-Device Model, Robotic
Method
V
22
35
V
CC
CC
2Y7 23
34 2A7
33 2A8
32 GND
31 2A9
30 2A10
29 2OE2
2Y8 24
GND 25
2Y9 26
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
2Y10 27
2OE1 28
Distributed V
Minimizes High-Speed Switching Noise
and GND Pin Configuration
CC
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
description
The ’ALVTH16827 devices are 20-bit buffers/line drivers designed for 2.5-V or 3.3-V V
the capability to provide a TTL interface to a 5-V system environment.
operation, but with
CC
The devices are composed of two 10-bit sections with separate output-enable signals. For either 10-bit buffer
section, the two output-enable (1OE1 and 1OE2, or 2OE1 and 2OE2) inputs must be low for the corresponding
Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer section are in the
high-impedance state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
Copyright 1998, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
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