SN54ALVTH16240, SN74ALVTH16240
2.5-V/3.3-V 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCES138A – JULY 1998 – REVISED JANUARY 1999
SN54ALVTH16240 . . . WD PACKAGE
SN74ALVTH16240 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
State-of-the-Art Advanced BiCMOS
Technology (ABT) Widebus Design for
2.5-V and 3.3-V Operation and Low Static
Power Dissipation
1OE
1Y1
1Y2
GND
1Y3
1Y4
1
2
3
4
5
6
7
8
9
48 2OE
47 1A1
46 1A2
45 GND
44 1A3
43 1A4
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 2.3-V to
3.6-V V
)
CC
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
A
High Drive (–24/24 mA at 2.5-V and
–32/64 mA at 3.3-V V
V
42
V
CC
CC
)
2Y1
2Y2
41 2A1
40 2A2
39 GND
38 2A3
37 2A4
36 3A1
35 3A2
34 GND
33 3A3
32 3A4
CC
Power Off Disables Outputs, Permitting
Live Insertion
GND 10
2Y3 11
2Y4 12
3Y1 13
3Y2 14
GND 15
3Y3 16
3Y4 17
High-Impedance State During Power Up
and Power Down Prevents Driver Conflict
Use Bus Hold on Data Inputs in Place of
External Pullup/Pulldown Resistors to
Prevent the Bus From Floating
Auto3-State Eliminates Bus Current
Loading When Output Exceeds V
+ 0.5 V
CC
V
18
31
V
CC
CC
Latch-Up Performance Exceeds 250 mA Per
JESD 17
4Y1 19
4Y2 20
GND 21
4Y3 22
4Y4 23
4OE 24
30 4A1
29 4A2
28 GND
27 4A3
26 4A4
25 3OE
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model; and Exceeds 1000 V
Using Charged-Device Model, Robotic
Method
Flow-Through Architecture Facilitates
Printed Circuit Board Layout
Distributed V
Minimizes High-Speed Switching Noise
and GND Pin Configuration
CC
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), Thin Very
Small-Outline (DGV) Packages, and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
description
The ’ALVTH16240 devices are 16-bit buffers/line drivers designed for 2.5-V or 3.3-V V
the capability to provide a TTL interface to a 5-V system environment.
operation, but with
CC
These devices are designed specifically to improve both the performance and density of 3-state memory
address drivers, clock drivers, and bus-oriented receivers and transmitters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments Incorporated.
Copyright 1999, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
1
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