SN74ALVCH16827-EP
20-BIT BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES676–SEPTEMBER 2006
FEATURES
DGG OR DL PACKAGE
(TOP VIEW)
•
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
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1OE1
1Y1
1OE2
1A1
2
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Extended Temperature Performance of –55°C
to 125°C
3
1Y2
GND
1Y3
1A2
GND
1A3
4
Enhanced Diminishing Manufacturing
Sources (DMS) Support
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1Y4
1A4
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Enhanced Product-Change Notification
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V
CC
V
CC
(1)
Qualification Pedigree
8
1Y5
1Y6
1Y7
GND
1Y8
1Y9
1Y10
2Y1
2Y2
2Y3
GND
2Y4
2Y5
2Y6
1A5
1A6
1A7
GND
1A8
1A9
1A10
2A1
2A2
2A3
GND
2A4
2A5
2A6
9
Member of the Texas Instruments Widebus™
Family
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EPIC™ (Enhanced-Performance Implanted
CMOS) Submicron Process
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model (C = 200 pF, R = 0)
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•
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Latch-Up Performance Exceeds 250 mA Per
JESD 17
Bus Hold on Data Inputs Eliminates the Need
for External Pullup/Pulldown Resistors
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages
V
CC
V
CC
2Y7
2Y8
2A7
2A8
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
GND
2Y9
2Y10
2OE1
GND
2A9
2A10
2OE2
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION
This 20-bit noninverting buffer/driver is designed for 1.65-V to 3.6-V VCC operation.
The SN74ALVCH16827 is composed of two 10-bit sections with separate output-enable signals. For either 10-bit
buffer section, the two output-enable (1OE1 and 1OE2 or 2OE1 and 2OE2) inputs must both be low for the
corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer
section are in the high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
–55°C to 125°C
SSOP – DL
Tape and reel
CALVCH16827MDLREP
ALVCH16827EP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus, EPIC are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.