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SN74AHCU04MPWREP PDF预览

SN74AHCU04MPWREP

更新时间: 2024-11-18 12:21:47
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路光电二极管
页数 文件大小 规格书
10页 495K
描述
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SN74AHCU04MPWREP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP, TSSOP14,.25针数:14
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:0.86系列:AHC/VHC/H/U/V
JESD-30 代码:R-PDSO-G14JESD-609代码:e4
长度:5 mm负载电容(CL):50 pF
逻辑集成电路类型:INVERTER最大I(ol):0.05 A
湿度敏感等级:1功能数量:1
输入次数:1端子数量:14
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP14,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TR
峰值回流温度(摄氏度):260电源:2/5.5 V
最大电源电流(ICC):0.02 mAProp。Delay @ Nom-Sup:14 ns
传播延迟(tpd):14 ns认证状态:Not Qualified
施密特触发器:NO座面最大高度:1.2 mm
子类别:Gates最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:4.4 mmBase Number Matches:1

SN74AHCU04MPWREP 数据手册

 浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第2页浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第3页浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第4页浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第5页浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第6页浏览型号SN74AHCU04MPWREP的Datasheet PDF文件第7页 
SN74AHCU04-EP  
HEX INVERTERS  
www.ti.com  
SCLS706MARCH 2007  
FEATURES  
Controlled Baseline  
Unbuffered Outputs  
One Assembly Site  
One Test Site  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
One Fabrication Site  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Extended Temperature Performance of –55°C  
to 125°C  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
1000-V Charged-Device Model (C101)  
D OR PW PACKAGE  
(TOP VIEW)  
Enhanced Product-Change Notification  
(1)  
Qualification Pedigree  
Operating Range 2-V to 5.5-V VCC  
VCC  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
1A  
1Y  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
6A  
6Y  
5A  
5Y  
4A  
4Y  
2A  
2Y  
3A  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
3Y  
8
GND  
DESCRIPTION/ORDERING INFORMATION  
The ’HC04 devices contain six independent inverters. They perform the Boolean function Y = A in positive logic.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ODERABLE PART NUMBER  
TOP-SIDE MARKING  
AHCU04M  
–55°C to 125°C  
TSSOP - PW  
Tape and Reel  
SN74AHCU04MPWREP  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
Web site at www.ti.com.  
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
(EACH INVERTER)  
INPUT  
A
OUTPUT  
Y
H
L
L
H
LOGIC DIAGRAM (POSITIVE LOGIC)  
A
Y
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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