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SN74AHCT541-EP PDF预览

SN74AHCT541-EP

更新时间： 2024-12-01 12:21:47
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
13页 715K
描述
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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SN74AHCT541-EP 数据手册

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SCAS778 − SEPTEMBER 2004  
DW PACKAGE  
(TOP VIEW)  
D
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
1
OE1  
A1  
A2  
V
CC  
20  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
2
19 OE2  
3
18 Y1  
D
D
D
D
Enhanced Product-Change Notification  
4
17  
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11  
A3  
A4  
A5  
A6  
A7  
A8  
GND  
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Y4  
Y5  
Y6  
Y7  
Y8  
†
5
Qualification Pedigree  
6
Inputs Are TTL-Voltage Compatible  
7
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
8
9
D
ESD Protection Exceeds JESD 22  
− 2000-V Human-Body Model (A114-A)  
− 200-V Machine Model (A115-A)  
10  
− 1000-V Charged-Device Model (C101)  
†
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
description/ordering information  
The SN74AHCT541 octal buffer/driver is ideal for driving bus lines or buffer memory address registers. This  
device features inputs and outputs on opposite sides of the package to facilitate printed circuit board layout.  
The 3-state control gate is a 2-input AND gate with active-low inputs so that if either output-enable (OE1 or OE2)  
input is high, all corresponding outputs are in the high-impedance state. The outputs provide noninverted data  
when they are not in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
‡
T
PACKAGE  
SOIC − DW  
A
−40°C to 85°C  
Tape and reel SN74AHCT541IDWREP  
AHCT541EP  
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
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Copyright 2004, Texas Instruments Incorporated  
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...13

中文翻译

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