SN74AHC245-EP
OCTAL BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
SCLS487A – MAY 2003 – REVISED JUNE 2003
DW OR PW PACKAGE
(TOP VIEW)
Controlled Baseline
– One Assembly/Test Site, One Fabrication
Site
DIR
A1
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
V
CC
Extended Temperature Performance of
–55°C to 125°C
OE
B1
B2
B3
B4
B5
B6
B7
B8
A2
Enhanced Diminishing Manufacturing
Sources (DMS) Support
A3
A4
Enhanced Product-Change Notification
A5
†
A6
Qualification Pedigree
A7
Operating Range 2-V to 5.5-V V
CC
A8
Latch-Up Performance Exceeds 250 mA Per
JESD 17
GND
ESD Protection Exceeds 1000 V Per
MIL-STD-833, Method 3015; Exceeds 100 V
Using Machine Model (C = 200 pF, R = 0)
†
Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description/ordering information
The SN74AHC245 octal bus transceiver is designed for asynchronous two-way communication between data
buses. The control-function implementation minimizes external timing requirements.
This device allows data transmission from the A bus to the B bus or from the B bus to the A bus, depending on
the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to disable the
device so that the buses effectively are isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup
CC
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
‡
PACKAGE
T
A
SOIC – DW
Tape and reel
SN74AHC245MDWREP
SN74AHC245MPWREP
AHC245MEP
AHC245EP
–55°C to 125°C
TSSOP – PW Tape and reel
‡
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265