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SN74AHC174PW PDF预览

SN74AHC174PW

更新时间: 2024-02-03 11:37:39
品牌 Logo 应用领域
德州仪器 - TI 触发器
页数 文件大小 规格书
7页 125K
描述
HEX D-TYPE FLIP-FLOPS WITH CLEAR

SN74AHC174PW 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:TSSOP
包装说明:TSSOP-16针数:16
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:1.23Is Samacsys:N
系列:AHC/VHC/H/U/VJESD-30 代码:R-PDSO-G16
JESD-609代码:e4长度:5 mm
负载电容(CL):50 pF逻辑集成电路类型:D FLIP-FLOP
最大频率@ Nom-Sup:80000000 Hz最大I(ol):0.008 A
湿度敏感等级:1位数:6
功能数量:1端子数量:16
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP16,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH包装方法:TR
峰值回流温度(摄氏度):260电源:2/5.5 V
最大电源电流(ICC):0.04 mAProp。Delay @ Nom-Sup:10.5 ns
传播延迟(tpd):16.5 ns认证状态:Not Qualified
座面最大高度:1.2 mm子类别:FF/Latches
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED触发器类型:POSITIVE EDGE
宽度:4.4 mm最小 fmax:110 MHz
Base Number Matches:1

SN74AHC174PW 数据手册

 浏览型号SN74AHC174PW的Datasheet PDF文件第2页浏览型号SN74AHC174PW的Datasheet PDF文件第3页浏览型号SN74AHC174PW的Datasheet PDF文件第4页浏览型号SN74AHC174PW的Datasheet PDF文件第5页浏览型号SN74AHC174PW的Datasheet PDF文件第6页浏览型号SN74AHC174PW的Datasheet PDF文件第7页 
SN54AHC174, SN74AHC174  
HEX D-TYPE FLIP-FLOPS  
WITH CLEAR  
SCLS425E – JUNE 1998 – REVISED JANUARY 2000  
SN54AHC174 . . . J OR W PACKAGE  
SN74AHC174 . . . D, DB, DGV, N, OR PW PACKAGE  
(TOP VIEW)  
EPIC (Enhanced-Performance Implanted  
CMOS) Process  
Operating Range 2-V to 5.5-V V  
CC  
Contain Six Flip-Flops With Single-Rail  
Outputs  
CLR  
1Q  
1D  
2D  
2Q  
3D  
3Q  
GND  
V
CC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
6Q  
6D  
5D  
5Q  
4D  
4Q  
CLK  
Applications Include:  
– Buffer/Storage Registers  
– Shift Registers  
– Pattern Generators  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 200-V Machine Model (A115-A)  
SN54AHC174 . . . FK PACKAGE  
(TOP VIEW)  
– 1000-V Charged-Device Model (C101)  
Package Options Include Plastic  
Small-Outline (D), Shrink Small-Outline  
(DB), Thin Very Small-Outline (DGV), Thin  
Shrink Small-Outline (PW), and Ceramic  
Flat (W) Packages, Ceramic Chip Carriers  
(FK), and Standard Plastic (N) and Ceramic  
(J) DIPs  
3
2
1
20 19  
18 6D  
1D  
2D  
NC  
2Q  
3D  
4
5
6
7
8
17  
16  
15  
14  
5D  
NC  
5Q  
4D  
9 10 11 12 13  
description  
TheAHC174devicesarepositive-edge-triggered  
D-typeflip-flopswithadirectclear(CLR)inputand  
NC – No internal connection  
are designed for 2-V to 5.5-V V  
operation.  
CC  
Information at the data (D) inputs that meets the setup time requirements is transferred to the outputs on the  
positive-going edge of the clock (CLK) pulse. Clock triggering occurs at a particular voltage level and is not  
directly related to the transition time of the positive-going edge of CLK. When CLK is at either the high or low  
level, the D input has no effect at the output.  
TheSN54AHC174 is characterized for operation over the full military temperature range of –55°C to 125°C. The  
SN74AHC174 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
(each flip-flop)  
INPUTS  
OUTPUT  
Q
CLR  
L
CLK  
D
X
H
L
X
L
H
L
H
H
H
L
X
Q
0
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC is a trademark of Texas Instruments Incorporated.  
Copyright 2000, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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