SN74ACT244-EP
OCTAL BUFFER/DRIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCAS724B–OCTOBER 2003–REVISED MARCH 2006
FEATURES
•
Controlled Baseline
DW OR NS PACKAGE
(TOP VIEW)
– One Assembly/Test Site, One Fabrication
Site
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
1OE
1A1
2Y4
1A2
2Y3
1A3
2Y2
1A4
2Y1
GND
V
CC
•
•
Extended Temperature Performance of up to
–55°C to 125°C
2OE
1Y1
2A4
1Y2
2A3
1Y3
2A2
1Y4
2A1
Enhanced Diminishing Manufacturing
Sources (DMS) Support
•
•
•
•
•
•
Enhanced Product-Change Notification
(1)
Qualification Pedigree
4.5-V to 5.5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 9.5 ns at 5 V
Inputs Are TTL Compatible
(1) Component qualification in accordance with JEDEC and
industry standards to ensure reliable operation over an
extended temperature range. This includes, but is not limited
to, Highly Accelerated Stress Test (HAST) or biased 85/85,
temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound
life. Such qualification testing should not be viewed as
justifying use of this component beyond specified
performance and environmental limits.
DESCRIPTION/ORDERING INFORMATION
The SN74ACT244-EP octal buffer/driver is designed specifically to improve the performance and density of
3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.
The device is organized as two 4-bit buffers/drivers with separate output-enable (OE) inputs. When OE is low,
the device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
–55°C to 125°C
–40°C to 85°C
PACKAGE(1)
ORDERABLE PART NUMBER
SN74ACT244MDWREP
SN74ACT244MNSREP
TOP-SIDE MARKING
SACT244MEP
SOIC – DW
SOP – NS
SOIC – DW
Tape and reel
Tape and reel
Tape and reel
SACT244MEP
SN74ACT244IDWREP
SACT244IEP
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH BUFFER)
INPUTS
OUTPUT
Y
OE
L
A
H
L
H
L
L
H
X
Z
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2006, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.