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SN74ABTH32316PNG4 PDF预览

SN74ABTH32316PNG4

更新时间: 2024-11-05 03:41:39
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路信息通信管理
页数 文件大小 规格书
12页 197K
描述
16-BIT TRI-PORT UNIVERSAL BUS EXCHANGERS

SN74ABTH32316PNG4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:QFP
包装说明:12 X 12 MM, 0.50 MM PITCH, GREEN, PLASTIC, TQFP-80针数:80
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.64Is Samacsys:N
系列:ABTJESD-30 代码:S-PQFP-G80
JESD-609代码:e4长度:12 mm
逻辑集成电路类型:BUS EXCHANGER湿度敏感等级:3
位数:16功能数量:1
端口数量:3端子数量:80
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:LFQFP
封装等效代码:QFP80,.55SQ,20封装形状:SQUARE
封装形式:FLATPACK, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:5 V传播延迟(tpd):7.5 ns
认证状态:Not Qualified座面最大高度:1.6 mm
子类别:Other Logic ICs最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:12 mmBase Number Matches:1

SN74ABTH32316PNG4 数据手册

 浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第2页浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第3页浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第4页浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第5页浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第6页浏览型号SN74ABTH32316PNG4的Datasheet PDF文件第7页 
SN54ABTH32316, SN74ABTH32316  
16-BIT TRI-PORT UNIVERSAL BUS EXCHANGERS  
SCBS179E – JUNE 1992 – REVISED MAY 1997  
Members of the Texas Instruments  
Widebus+ Family  
High-Impedance State During Power Up  
and Power Down  
State-of-the-Art EPIC-ΙΙB BiCMOS Design  
Significantly Reduces Power Dissipation  
Distributed V  
Minimizes High-Speed Switching Noise  
and GND Pin Configuration  
CC  
UBE (Universal Bus Exchanger)  
High-Drive Outputs (–32-mA I , 64-mA I  
OH  
)
OL  
Combines D-Type Latches and D-Type  
Flip-Flops for Operation in Transparent,  
Latched, Clocked, or Clock-Enabled Mode  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015  
Package Options Include 80-Pin Plastic  
Thin Quad Flat (PN) Package With  
Latch-Up Performance Exceeds 500 mA  
Per JEDEC Standard JESD-17  
12 × 12-mm Body Using 0.5-mm Lead Pitch  
and 84-Pin Ceramic Quad Flat (HT) Package  
Typical V  
< 0.8 V at V  
(Output Ground Bounce)  
OLP  
= 5 V, T = 25°C  
CC  
A
’ABTH32316 . . . PN PACKAGE  
(TOP VIEW)  
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61  
A2  
A3  
A4  
GND  
A5  
A6  
A7  
A8  
A9  
C8  
C7  
C6  
GND  
C5  
C4  
C3  
C2  
C1  
1
60  
59  
58  
57  
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
2
3
4
5
6
7
8
9
V
V
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
CC  
CC  
GND  
A10  
A11  
A12  
A13  
A14  
GND  
A15  
A16  
NC  
GND  
B16  
B15  
B14  
B13  
B12  
GND  
B11  
B10  
B9  
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40  
NC – No internal connection  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus+, EPIC-ΙΙB, and UBE are trademarks of Texas Instruments Incorporated.  
Copyright 1997, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN74ABTH32316PNG4 替代型号

型号 品牌 替代类型 描述 数据表
SN74ABTH32316PN TI

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