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SN74ABT541BDWE4 PDF预览

SN74ABT541BDWE4

更新时间: 2024-11-12 05:18:07
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路光电二极管输出元件信息通信管理
页数 文件大小 规格书
20页 588K
描述
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

SN74ABT541BDWE4 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SOIC
包装说明:SOP, SOP20,.4针数:20
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.24Is Samacsys:N
其他特性:WITH DUAL OUTPUT ENABLE控制类型:ENABLE LOW
系列:ABTJESD-30 代码:R-PDSO-G20
JESD-609代码:e4长度:12.8 mm
负载电容(CL):50 pF逻辑集成电路类型:BUS DRIVER
最大I(ol):0.064 A湿度敏感等级:1
位数:8功能数量:1
端口数量:2端子数量:20
最高工作温度:85 °C最低工作温度:-40 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP20,.4封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:5 V最大电源电流(ICC):30 mA
Prop。Delay @ Nom-Sup:3.9 ns传播延迟(tpd):3.9 ns
认证状态:Not Qualified座面最大高度:2.65 mm
子类别:Bus Driver/Transceivers最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:BICMOS
温度等级:INDUSTRIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:7.5 mmBase Number Matches:1

SN74ABT541BDWE4 数据手册

 浏览型号SN74ABT541BDWE4的Datasheet PDF文件第2页浏览型号SN74ABT541BDWE4的Datasheet PDF文件第3页浏览型号SN74ABT541BDWE4的Datasheet PDF文件第4页浏览型号SN74ABT541BDWE4的Datasheet PDF文件第5页浏览型号SN74ABT541BDWE4的Datasheet PDF文件第6页浏览型号SN74ABT541BDWE4的Datasheet PDF文件第7页 
SN54ABT541, SN74ABT541B  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCBS093LDECEMBER 1993REVISED DECEMBER 2006  
FEATURES  
State-of-the-Art EPIC-IIB™ BiCMOS Design  
Significantly Reduces Power Dissipation  
SN54ABT541...J OR W PACKAGE  
SN74ABT541B...DB, DW, N, OR PW PACKAGE  
(TOP VIEW)  
Latch-Up Performance Exceeds 500 mA Per  
JEDEC Standard JESD-17  
VCC  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
OE1  
A1  
2
OE2  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
Typical VOLP (Output Ground Bounce) < 1 V at  
VCC = 5 V, TA = 25°C  
3
A2  
4
A3  
5
A4  
High-Impedance State During Power Up and  
Power Down  
6
A5  
7
A6  
8
A7  
High-Drive Outputs (–32-mA IOH, 64-mA IOL)  
9
A8  
Package Options Include Plastic Small-Outline  
(DW), Shrink Small-Outline (DB), and Thin  
Shrink Small-Outline (PW) Packages, Ceramic  
Chip Carriers (FK), Ceramic Flat (W) Package,  
and Plastic (N) and Ceramic (J) DIPs  
10  
GND  
SN54ABT541...FK PACKAGE  
(TOP VIEW)  
3
2
1
20 19  
18  
17  
16  
15  
14  
Y1  
Y2  
Y3  
Y4  
Y5  
4
5
6
7
8
A3  
A4  
A5  
A6  
A7  
9
10 11 12 13  
DESCRIPTION/ORDERING INFORMATION  
The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or buffering  
memory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitate  
printed circuit board layout.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74ABT541BN  
TOP-SIDE MARKING  
PDIP – N  
Reel of 1000  
SN74ABT541BN  
Tube of 25  
SN74ABT541BDW  
SN74ABT541BDWR  
SN74ABT541BDBR  
SN74ABT541BDBRG4  
SN74ABT541BPW  
SN74ABT541BPWR  
SNJ54ABT541J  
SOIC – DW  
ABT541B  
AB541B  
AB541B  
Reel of 2000  
–40°C to 85°C  
SSOP – DB  
Reel of 2000  
Reel of 1050  
Reel of 2000  
Reel of 1000  
Reel of 510  
Reel of 2200  
TSSOP – PW  
CDIP – J  
CFP – W  
LCCC – FK  
SNJ54ABT541J  
SNJ54ABT541W  
SNJ54ABT541FK  
–55°C to 125°C  
SNJ54ABT541W  
SNJ54ABT541FK  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC-IIB is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1993–2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

SN74ABT541BDWE4 替代型号

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