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SN74ABT244AMDBREP PDF预览

SN74ABT244AMDBREP

更新时间： 2024-11-24 12:15:03
品牌 Logo 应用领域
德州仪器 - TI 驱动器输出元件
页数 文件大小 规格书
10页 292K
描述
OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS

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SN74ABT244AMDBREP 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SSOP
包装说明：SSOP, SSOP20,.3针数：20
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：0.95Samacsys Description：Enhanced Product Octal Buffers/Drivers With 3-State Outputs
控制类型：ENABLE LOW计数方向：UNIDIRECTIONAL
系列：ABTJESD-30 代码：R-PDSO-G20
JESD-609代码：e4长度：7.2 mm
负载电容（CL）：50 pF逻辑集成电路类型：BUS DRIVER
最大I（ol）：0.048 A湿度敏感等级：1
位数：4功能数量：2
端口数量：2端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
输出特性：3-STATE输出极性：TRUE
封装主体材料：PLASTIC/EPOXY封装代码：SSOP
封装等效代码：SSOP20,.3封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, SHRINK PITCH包装方法：TR
峰值回流温度（摄氏度）：260电源：5 V
最大电源电流（ICC）：30 mAProp。Delay @ Nom-Sup：5 ns
传播延迟（tpd）：5.3 ns认证状态：Not Qualified
座面最大高度：2 mm子类别：Bus Driver/Transceivers
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：4.5 V
标称供电电压 (Vsup)：5 V表面贴装：YES
技术：BICMOS温度等级：MILITARY
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED翻译：N/A
宽度：5.3 mm

SN74ABT244AMDBREP 数据手册

 浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第2页浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第3页浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第4页浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第5页浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第6页浏览型号SN74ABT244AMDBREP的Datasheet PDF文件第7页 
SN74ABT244A-EP  
OCTAL BUFFER/DRIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SGBS312A–JULY 2006–REVISED JULY 2006  
FEATURES  
•
Controlled Baseline  
•
Typical VOLP (Output Ground Bounce) <1 V at  
VCC = 5 V, TA = 25°C  
– One Assembly/Test Site, One Fabrication  
Site  
•
•
High-Drive Outputs (–24-mA IOH, 48-mA IOL)  
•
•
Extended Temperature Performance of –55°C  
to 125°C  
Packaged in Shrink Small-Outline (DB)  
Package  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
DB PACKAGE  
(TOP VIEW)  
•
•
•
Enhanced Product-Change Notification  
(1)  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
1OE  
1A1  
2Y4  
1A2  
2Y3  
1A3  
2Y2  
1A4  
2Y1  
GND  
VCC  
2OE  
1Y1  
2A4  
1Y2  
2A3  
1Y3  
2A2  
1Y4  
2A1  
Qualification Pedigree  
2
State-of-the-Art EPIC-IIB™ BiCMOS Design  
Significantly Reduces Power Dissipation  
3
4
•
•
Latch-Up Performance Exceeds 500 mA Per  
JEDEC Standard JESD-17  
5
6
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
7
8
9
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
10  
xxxx  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION  
This octal buffer and line driver is designed specifically to improve both the performance and density of 3-state  
memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Together with the  
SN54ABT240, SN74ABT240A, SN54ABT241, and SN74ABT241A, these devices provide the choice of selected  
combinations of inverting and noninverting outputs, symmetrical active-low output-enable (OE) inputs, and  
complementary OE and OE inputs.  
The SN74ABT244A is organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the  
device passes noninverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
The SN74ABT244 is characterized for operation over the full military temperature range of –55°C to 125°C.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–55°C to 125°C  
SSOP – DB  
Tape and reel  
SN74ABT244AMDBREP  
ABT244AMEP  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC-IIB is a trademark of Texas Intruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...10

中文翻译

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SN74ABT244AMDBREP 替代型号

型号 品牌 替代类型 描述 数据表
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