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SN65HVD09

更新时间： 2024-11-20 06:12:51
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德州仪器 - TI /
页数 文件大小 规格书
25页 607K
描述
9-CHANNEL RS-422 / RS-485 TRANSCEIVER

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SN65HVD09 数据手册

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SN65HVD09  
www.ti.com ............................................................................................................................................................................................ SLLS941–DECEMBER 2008  
9-CHANNEL RS-422 / RS-485 TRANSCEIVER  
Each of the nine half-duplex channels of the HVD09  
is designed to operate with either RS-422 or RS-485  
communication networks.  
1
FEATURES  
•
Designed to Operate at up to 20 Million Data  
Transfers per Second on Each RS-422/RS-485  
Channel  
The SN65HVD09 is characterized for operation over  
an ambient air temperature range of –40°C to 85°C.  
•
SN65HVD09 Packaged in Thin Shrink  
Small-Outline Package with 0.5-mm Pin Pitch  
SN65HVD09 DGG  
(TOP VIEW)  
•
•
•
•
•
ESD Protection on Bus Pins Exceeds 12kV  
Low Disabled Supply Current 8 mA Typ  
Thermal Shutdown Protection  
GND  
BSR  
GRE  
CDE2  
CDE1  
CDE0  
9B+  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
2
3
Positive- and Negative-Current Limiting  
Power-Up/Down Glitch Protection  
4
1A  
1DE/RE  
2A  
9B-  
5
6
8B+  
8B-  
7B+  
7B-  
6B+  
6B-  
VCC  
7
2DE/RE  
3A  
DESCRIPTION  
8
The SN65HVD09 is a 9-channel RS-422 / RS-485  
transceiver suitable for industrial applications. It offers  
improved switching performance, a small package,  
and high ESD protection. The precise skew limits  
ensures that the propagation delay times, not only  
from channel-to-channel but from device-to-device,  
are closely matched for the tight skew budgets  
associated with high-speed parallel data buses.  
9
3DE/RE  
4A  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
4DE/RE  
VCC  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
GND  
VCC  
GND  
VCC  
Patented thermal enhancements are used in the thin  
shrink, small-outline package (TSSOP), allowing  
operation over the industrial temperature range. The  
TSSOP package offers very small board area  
requirements while reducing the package height to  
1 mm. This provides more board area and allows  
component mounting to both sides of the printed  
circuit boards for low-profile, space-restricted  
applications such as small form-factor hard disk  
drives.  
5B+  
5B-  
5A  
5DE/RE  
6A  
6DE/RE  
7A  
4B+  
4B-  
3B+  
3B-  
2B+  
2B-  
1B+  
1B-  
7DE/RE  
8A  
8DE/RE  
9A  
9DE/RE  
The HVD09 can withstand electrostatic discharges  
exceeding 12 kV using the human-body model, and  
600 V using the machine model on the RS-485 I/O  
terminals. This provides protection from the noise that  
can be coupled into external cables. The other  
terminals of the device can withstand discharges  
exceeding 4 kV and 400 V respectively.  
Terminals 13 through 17, and 40 through 44 are  
connected together to the package lead frame  
and signal ground.  
9 Differential  
RS-422/RS-485  
I/O Channels  
Configuration and  
Control Logic  
HVD09  
9 Single-ended TTL  
I/O Channels  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2008, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
1234567...25

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