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SCBS688G − MAY 1997 − REVISED SEPTEMBER 2003
D
D
D
D
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
D
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
)
CC
Support Unregulated Battery Operation
Down to 2.7 V
D
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
Typical V
<0.8 V at V
(Output Ground Bounce)
OLP
CC
= 3.3 V, T = 25°C
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
A
I
and Power-Up 3-State Support Hot
off
Insertion
SN54LVTH574 . . . FK PACKAGE
(TOP VIEW)
SN74LVTH574 . . . RGY PACKAGE
(TOP VIEW)
SN54LVTH574 . . . J OR W PACKAGE
SN74LVTH574 . . . DB, DW, NS,
OR PW PACKAGE
(TOP VIEW)
1
20
3
2
1 20 19
18
OE
1D
2D
3D
4D
5D
6D
7D
8D
V
CC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
2Q
3Q
4Q
5Q
6Q
3D
4D
5D
6D
7D
4
5
6
7
8
19
18
17
16
15
14
13
12
2
3
4
5
6
7
8
9
1D
2D
3D
4D
5D
6D
7D
8D
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
1Q
2Q
3Q
17
16
15
14
16 4Q
15 5Q
9 10 11 12 13
14
13
12
11
6Q
7Q
8Q
CLK
10
11
GND
description/ordering information
These octal flip-flops are designed specifically for low-voltage (3.3-V) V
provide a TTL interface to a 5-V system environment.
operation, but with the capability to
CC
ORDERING INFORMATION
ORDERABLE
TOP-SIDE
MARKING
†
PACKAGE
T
A
PART NUMBER
SN74LVTH574RGYR
SN74LVTH574DW
SN74LVTH574DWR
SN74LVTH574NSR
SN74LVTH574DBR
SN74LVTH574PW
SN74LVTH574PWR
SN74LVTH574GQNR
SN74LVTH574ZQNR
SNJ54LVTH574J
QFN − RGY
SOIC − DW
Tape and reel
Tube
LXH574
LVTH574
Tape and reel
Tape and reel
Tape and reel
Tube
SOP − NS
LVTH574
LXH574
SSOP − DB
−40°C to 85°C
TSSOP − PW
LXH574
LXH574
Tape and reel
VFBGA − GQN
Tape and reel
VFBGA − ZQN (Pb-free)
CDIP − J
Tube
Tube
Tube
SNJ54LVTH574J
SNJ54LVTH574W
SNJ54LVTH574FK
CFP − W
SNJ54LVTH574W
SNJ54LVTH574FK
−55°C to 125°C
LCCC − FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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