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SN54LVTH574 PDF预览

SN54LVTH574

更新时间: 2024-11-23 23:03:07
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德州仪器 - TI 触发器输出元件
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7页 97K
描述
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS

SN54LVTH574 数据手册

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SN54LVTH574, SN74LVTH574  
3.3-V ABT OCTAL EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCBS688D – MAY 1997 – REVISED APRIL 1999  
SN54LVTH574 . . . J OR W PACKAGE  
SN74LVTH574 . . . DB, DW, OR PW PACKAGE  
(TOP VIEW)  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V  
Operation and Low Static-Power  
Dissipation  
OE  
1D  
2D  
3D  
4D  
5D  
6D  
7D  
8D  
V
CC  
1
2
3
4
5
6
7
8
9
20  
19  
18  
17  
16  
15  
14  
Support Mixed-Mode Signal Operation (5-V  
Input and Output Voltages With 3.3-V V  
1Q  
2Q  
3Q  
4Q  
5Q  
6Q  
)
CC  
Support Unregulated Battery Operation  
Down to 2.7 V  
Typical V  
< 0.8 V at V  
(Output Ground Bounce)  
OLP  
= 3.3 V, T = 25°C  
CC  
A
13 7Q  
12 8Q  
11 CLK  
I
and Power-Up 3-State Support Hot  
off  
Insertion  
GND 10  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
SN54LVTH574 . . . FK PACKAGE  
(TOP VIEW)  
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
3
2
1 20 19  
18  
2Q  
3Q  
4Q  
5Q  
6Q  
3D  
4D  
5D  
6D  
7D  
4
5
6
7
8
17  
16  
15  
14  
Package Options Include Plastic  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages, Ceramic Chip Carriers (FK),  
Ceramic Flat (W) Package, and Ceramic (J)  
DIPs  
9 10 11 12 13  
description  
These octal flip-flops are designed specifically for low-voltage (3.3-V) V  
provide a TTL interface to a 5-V system environment.  
operation, but with the capability to  
CC  
The eight flip-flops of the ’LVTH574 devices are edge-triggered D-type flip-flops. On the positive transition of  
the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.  
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high  
or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive  
the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus  
lines without need for interface or pullup components.  
OE does not affect the internal operations of the flip-flops. Old data can be retained or new data can be entered  
while the outputs are in the high-impedance state.  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.  
When V is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
through a pullup resistor;  
CC  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1999, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

SN54LVTH574 替代型号

型号 品牌 替代类型 描述 数据表
SN74LVTH574 TI

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