SN54LVT16501, SN74LVT16501
3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS147G – MAY 1992 – REVISED NOVEMBER 1996
SN54LVT16501 . . . WD PACKAGE
SN74LVT16501 . . . DGG OR DL PACKAGE
(TOP VIEW)
State-of-the-Art Advanced BiCMOS
Technology (ABT) Design for 3.3-V
Operation and Low-Static Power
Dissipation
1
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
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31
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OEAB
LEAB
A1
GND
CLKAB
B1
Members of the Texas Instruments
Widebus Family
2
3
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V V
4
GND
A2
GND
B2
)
5
CC
6
Support Unregulated Battery Operation
Down to 2.7 V
A3
B3
7
V
V
B4
CC
A4
CC
8
UBT (Universal Bus Transceiver)
Combines D-Type Latches and D-Type
Flip-Flops for Operation in Transparent,
Latched, or Clocked Mode
9
A5
A6
B5
B6
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
GND
A7
A8
GND
B7
B8
Typical V
< 0.8 V at V
(Output Ground Bounce)
OLP
= 3.3 V, T = 25°C
CC
A
A9
B9
ESD Protection Exceeds 2000 V Per
MIL-STD-883, Method 3015; Exceeds 200 V
Using Machine Model
A10
A11
A12
GND
A13
A14
A15
B10
B11
B12
GND
B13
B14
B15
(C = 200 pF, R = 0)
Latch-Up Performance Exceeds 500 mA
Per JEDEC Standard JESD-17
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
V
V
CC
CC
A16
A17
GND
A18
OEBA
LEBA
B16
B17
GND
B18
CLKBA
GND
Support Live Insertion
Distributed V
Minimizes High-Speed Switching Noise
and GND Pin Configuration
CC
Flow-Through Architecture Optimizes
PCB Layout
Package Options Include Plastic 300-mil
Shrink Small-Outline (DL) and Thin Shrink
Small-Outline (DGG) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The ’LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) V
the capability to provide a TTL interface to a 5-V system environment.
operation, but with
CC
Data flow in each direction is controlled by output-enable (OEAB and OEBA), latch-enable (LEAB and LEBA),
and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when
LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is
low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high,
the outputs are active. When OEAB is low, the outputs are in the high-impedance state.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and UBT are trademarks of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
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POST OFFICE BOX 655303 • DALLAS, TEXAS 75265