是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | DIP |
包装说明: | DIP, DIP28,.6 | 针数: | 28 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.79 | 其他特性: | 16 BIT FLIP-FLOP FOLLOWED BY OCTAL 2:1 MUX |
系列: | LS | JESD-30 代码: | R-CDIP-T28 |
JESD-609代码: | e0 | 长度: | 37.15 mm |
逻辑集成电路类型: | MULTIPLEXER | 功能数量: | 1 |
输入次数: | 16 | 输出次数: | 8 |
端子数量: | 28 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 输出特性: | OPEN-COLLECTOR |
输出极性: | TRUE | 封装主体材料: | CERAMIC, METAL-SEALED COFIRED |
封装代码: | DIP | 封装等效代码: | DIP28,.6 |
封装形状: | RECTANGULAR | 封装形式: | IN-LINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 传播延迟(tpd): | 70 ns |
认证状态: | Not Qualified | 座面最大高度: | 5.84 mm |
子类别: | FF/Latches | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | NO | 技术: | TTL |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
触发器类型: | POSITIVE EDGE | 宽度: | 15.24 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SN54LS608J | TI |
获取价格 |
SPECIALTY MICROPROCESSOR CIRCUIT, CDIP16, CERAMIC, DIP-16 | |
SN54LS610 | TI |
获取价格 |
SN54LS610, SN54LS612, SN74LS610 THRU 74LS613 MEMORY MAPPERS | |
SN54LS610FK | TI |
获取价格 |
12 I/O, PIA-GENERAL PURPOSE, CQCC44 | |
SN54LS610JD | TI |
获取价格 |
12 I/O, PIA-GENERAL PURPOSE, CDIP40 | |
SN54LS611 | TI |
获取价格 |
SN54LS610, SN54LS612, SN74LS610 THRU 74LS613 MEMORY MAPPERS | |
SN54LS611FK | TI |
获取价格 |
12 I/O, PIA-GENERAL PURPOSE, CQCC44 | |
SN54LS611JD | TI |
获取价格 |
12 I/O, PIA-GENERAL PURPOSE, CDIP40 | |
SN54LS612 | TI |
获取价格 |
SN54LS610, SN54LS612, SN74LS610 THRU 74LS613 MEMORY MAPPERS | |
SN54LS612FK | TI |
获取价格 |
12 I/O, PIA-GENERAL PURPOSE, CQCC44 | |
SN54LS612JD | TI |
获取价格 |
暂无描述 |