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SN54AHC541W PDF预览

SN54AHC541W

更新时间: 2024-11-01 23:06:07
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路输出元件
页数 文件大小 规格书
18页 567K
描述
OCTAL BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

SN54AHC541W 技术参数

生命周期:Obsolete零件包装代码:DFP
包装说明:CERAMIC, FP-20针数:20
Reach Compliance Code:unknown风险等级:5.45
Is Samacsys:N其他特性:WITH DUAL OUTPUT ENABLE
系列:AHCJESD-30 代码:R-GDFP-F20
长度:13.09 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER位数:8
功能数量:1端口数量:2
端子数量:20最高工作温度:125 °C
最低工作温度:-55 °C输出特性:3-STATE
输出极性:TRUE封装主体材料:CERAMIC, GLASS-SEALED
封装代码:DFP封装形状:RECTANGULAR
封装形式:FLATPACK传播延迟(tpd):12 ns
认证状态:Not Qualified座面最大高度:2.54 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):2 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:FLAT端子节距:1.27 mm
端子位置:DUAL宽度:6.92 mm
Base Number Matches:1

SN54AHC541W 数据手册

 浏览型号SN54AHC541W的Datasheet PDF文件第2页浏览型号SN54AHC541W的Datasheet PDF文件第3页浏览型号SN54AHC541W的Datasheet PDF文件第4页浏览型号SN54AHC541W的Datasheet PDF文件第5页浏览型号SN54AHC541W的Datasheet PDF文件第6页浏览型号SN54AHC541W的Datasheet PDF文件第7页 
SN54AHC541, SN74AHC541  
OCTAL BUFFERS/DRIVERS  
WITH 3-STATE OUTPUTS  
SCLS261M – DECEMBER 1995 – REVISED JULY 2003  
SN54AHC541 . . . J OR W PACKAGE  
SN74AHC541 . . . DB, DGV, DW, N, NS, OR PW PACKAGE  
(TOP VIEW)  
Operating Range 2-V to 5.5-V V  
CC  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
OE1  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
V
CC  
19 OE2  
1
2
3
4
5
6
7
8
9
10  
20  
description/ordering information  
18  
17  
16  
15  
14  
13  
12  
11  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
The ’AHC541 octal buffers/drivers are ideal for  
driving bus lines or buffer memory address  
registers. These devices feature inputs and  
outputs on opposite sides of the package to  
facilitate printed circuit board layout.  
The 3-state control gate is a two-input AND gate  
with active-low inputs so that if either  
output-enable (OE1 or OE2) input is high, all  
corresponding outputs are in the high-impedance  
state. The outputs provide noninverted data when  
they are not in the high-impedance state.  
GND  
SN54AHC541 . . . FK PACKAGE  
(TOP VIEW)  
To ensure the high-impedance state during power  
up or power down, OE should be tied to V  
CC  
through a pullup resistor; the minimum value of  
the resistor is determined by the current-sinking  
capability of the driver.  
3
2
1 20 19  
18  
Y1  
Y2  
Y3  
Y4  
Y5  
A3  
A4  
A5  
A6  
A7  
4
5
6
7
8
17  
16  
15  
14  
9 10 11 12 13  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP – N  
Tube  
SN74AHC541N  
SN74AHC541N  
Tube  
SN74AHC541DW  
SN74AHC541DWR  
SN74AHC541NSR  
SN74AHC541DBR  
SN74AHC541PW  
SN74AHC541PWR  
SOIC – DW  
AHC541  
Tape and reel  
Tape and reel  
Tape and reel  
Tube  
SOP – NS  
AHC541  
HA541  
–40°C to 85°C  
SSOP – DB  
TSSOP – PW  
HA541  
Tape and reel  
Tape and reel  
Tube  
TVSOP – DGV  
CDIP – J  
SN74AHC541DGVR  
SNJ54AHC541J  
HA541  
SNJ54AHC541J  
SNJ54AHC541W  
SNJ54AHC541FK  
–55°C to 125°C  
CFP – W  
Tube  
SNJ54AHC541W  
SNJ54AHC541FK  
LCCC – FK  
Tube  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines  
are available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2003, Texas Instruments Incorporated  
On products compliant to MIL-PRF-38535, all parameters are tested  
unless otherwise noted. On all other products, production  
processing does not necessarily include testing of all parameters.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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