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SN54ABT827FK PDF预览

SN54ABT827FK

更新时间: 2024-11-11 23:06:07
品牌 Logo 应用领域
德州仪器 - TI 总线驱动器总线收发器逻辑集成电路输出元件信息通信管理
页数 文件大小 规格书
16页 395K
描述
10-BIT BUFFERS/DRIVERS WITH 3-STATE OUTPUTS

SN54ABT827FK 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFN包装说明:CERAMIC, CC-28
针数:28Reach Compliance Code:not_compliant
ECCN代码:3A001.A.2.CHTS代码:8542.39.00.01
风险等级:5.76Is Samacsys:N
其他特性:WITH DUAL OUTPUT ENABLE控制类型:ENABLE LOW
系列:ABTJESD-30 代码:S-CQCC-N28
长度:11.43 mm负载电容(CL):50 pF
逻辑集成电路类型:BUS DRIVER最大I(ol):0.048 A
位数:10功能数量:1
端口数量:2端子数量:28
最高工作温度:125 °C最低工作温度:-55 °C
输出特性:3-STATE输出极性:TRUE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QCCN
封装等效代码:LCC28,.45SQ封装形状:SQUARE
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
电源:5 V最大电源电流(ICC):40 mA
传播延迟(tpd):4.9 ns认证状态:Not Qualified
座面最大高度:2.03 mm子类别:Bus Driver/Transceivers
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):4.5 V
标称供电电压 (Vsup):5 V表面贴装:YES
技术:BICMOS温度等级:MILITARY
端子形式:NO LEAD端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:11.43 mmBase Number Matches:1

SN54ABT827FK 数据手册

 浏览型号SN54ABT827FK的Datasheet PDF文件第2页浏览型号SN54ABT827FK的Datasheet PDF文件第3页浏览型号SN54ABT827FK的Datasheet PDF文件第4页浏览型号SN54ABT827FK的Datasheet PDF文件第5页浏览型号SN54ABT827FK的Datasheet PDF文件第6页浏览型号SN54ABT827FK的Datasheet PDF文件第7页 
ꢋ ꢌ ꢍꢅꢎ ꢆ ꢅꢏꢐ ꢐ ꢑꢒꢀꢓ ꢔ ꢒꢎ ꢕ ꢑꢒ  
SCBS159E − JANUARY 1991 − REVISED APRIL 2005  
SN54ABT827 . . . JT PACKAGE  
SN74ABT827 . . . DB, DW, NT, OR PW PACKAGE  
(TOP VIEW)  
D
D
D
D
D
State-of-the-Art EPIC-ΙΙBBiCMOS Design  
Significantly Reduces Power Dissipation  
Flow-Through Architecture Optimizes PCB  
Layout  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
OE1  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
V
CC  
2
Latch-Up Performance Exceeds 500 mA Per  
JEDEC Standard JESD-17  
Y1  
Y2  
Y3  
Y4  
Y5  
Y6  
Y7  
Y8  
Y9  
Y10  
OE2  
3
4
Typical V  
(Output Ground Bounce) < 1 V  
OLP  
5
at V  
= 5 V, T = 25°C  
CC  
A
6
High-Impedance State During Power Up  
and Power Down  
7
8
D
High-Drive Outputs (−32-mA I , 64-mA I  
)
OL  
OH  
9
D
Package Options Include Plastic  
10  
11  
12  
A9  
A10  
GND  
Small-Outline (DW), Shrink Small-Outline  
(DB), and Thin Shrink Small-Outline (PW)  
Packages, Ceramic Chip Carriers (FK), and  
Plastic (NT) and Ceramic (JT) DIPs  
SN54ABT827 . . . FK PACKAGE  
(TOP VIEW)  
description  
These 10-bit buffers or bus drivers provide a  
high-performance bus interface for wide data  
paths or buses carrying parity.  
4
3
2
1
28 27 26  
25  
5
6
7
8
9
A3  
A4  
A5  
NC  
A6  
Y3  
Y4  
Y5  
NC  
Y6  
24  
23  
22  
21  
The 3-state control gate is a 2-input AND gate with  
active-low inputs so that, if either output-enable  
(OE1 or OE2) input is high, all ten outputs are in  
the high-impedance state. The ’ABT827 provides  
true data at the outputs.  
A7 10  
A8 11  
20 Y7  
19 Y8  
When V  
is between 0 and 2.1 V, the device  
12 13 14 15 16 17 18  
CC  
is in the high-impedance state during power up  
or power down. However, to ensure  
the high-impedance state above 2.1 V, OE should  
NC − No internal connection  
be tied to V  
through a pullup resistor; the  
CC  
minimum value of the resistor is determined by  
the current-sinking capability of the driver.  
The SN54ABT827 is characterized for operation over the full military temperature range of −55°C to 125°C. The  
SN74ABT827 is characterized for operation from −40°C to 85°C.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
Y
OE1  
L
OE2  
L
A
L
L
H
Z
Z
L
L
H
X
X
H
X
X
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC-ΙΙB is a trademark of Texas Instruments.  
ꢆꢧ  
Copyright 2005, Texas Instruments Incorporated  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢱ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢬ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  

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